公开(公告)号：US20170263490A1

公开(公告)日：2017-09-14

申请号：US15446059

申请日：2017-03-01

Applicant: Infineon Technologies AG

Inventor： Ingo MURI ,  Alexander BINTER ,  Bernhard GOLLER ,  Christian GRINDLING

IPC: H01L21/683 ,  B23C3/13 ,  H01L21/67 ,  B23Q3/08

CPC classification number: H01L21/6838 ,  B23C3/13 ,  B23Q3/088 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/11 ,  Y10T409/303808 ,  Y10T409/30868

Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.

公开(公告)号：US20210167036A1

公开(公告)日：2021-06-03

申请号：US17101339

申请日：2020-11-23

Applicant: Infineon Technologies AG

Inventor： Oliver HELLMUND ,  Barbara EICHINGER ,  Thorsten MEYER ,  Ingo MURI

IPC: H01L23/00 ,  H01L23/544 ,  H01L21/78

Abstract: A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a metal plate. When viewed in a direction perpendicular to the surface of the semiconductor die, a footprint of the electrical contact and a footprint of the metal layer are substantially congruent.

公开(公告)号：US20170259354A1

公开(公告)日：2017-09-14

申请号：US15065914

申请日：2016-03-10

Applicant: Infineon Technologies AG

Inventor： Ingo MURI ,  Alexander BINTER ,  Bernhard GOLLER ,  Christian GRINDLING

IPC: B23C3/13 ,  H01L21/304 ,  H01L21/67 ,  B23Q3/08 ,  H01L21/683

CPC classification number: B23C3/13 ,  B23Q3/088 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6838 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/11 ,  Y10T409/3042

Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including a support carrier; and a workpiece-support replaceably mounted on the support carrier; and a planarization tool configured to planarize the at least one portion of the workpiece-support and to planarize one or more workpieces on the at least one portion of the workpiece-support.