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公开(公告)号：US20210172862A1
公开(公告)日：2021-06-10
申请号：US16951365
申请日：2020-11-18
Applicant: Infineon Technologies AG
Inventor： Siyuan Qi , Joachim Eder , Christoph Glacer , Dominic Maier , Mark Pavier
Abstract: The present disclosure concerns an emitter package for a photoacoustic sensor, the emitter package comprising a MEMS infrared radiation source for emitting pulsed infrared radiation in a first wavelength range. The MEMS infrared radiation source may be arranged on a substrate. The emitter package may further comprise a rigid wall structure being arranged on the substrate and laterally surrounding a periphery of the MEMS infrared radiation source. The emitter package may further comprise a lid structure being attached to the rigid wall structure, the lid structure comprising a filter structure for filtering the infrared radiation emitted from the MEMS infrared radiation source and for providing a filtered infrared radiation in a reduced second wavelength range.
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公开(公告)号：US11609180B2
公开(公告)日：2023-03-21
申请号：US16951365
申请日：2020-11-18
Applicant: Infineon Technologies AG
Inventor： Siyuan Qi , Joachim Eder , Christoph Glacer , Dominic Maier , Mark Pavier
Abstract: The present disclosure concerns an emitter package for a photoacoustic sensor, the emitter package comprising a MEMS infrared radiation source for emitting pulsed infrared radiation in a first wavelength range. The MEMS infrared radiation source may be arranged on a substrate. The emitter package may further comprise a rigid wall structure being arranged on the substrate and laterally surrounding a periphery of the MEMS infrared radiation source. The emitter package may further comprise a lid structure being attached to the rigid wall structure, the lid structure comprising a filter structure for filtering the infrared radiation emitted from the MEMS infrared radiation source and for providing a filtered infrared radiation in a reduced second wavelength range.
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