公开(公告)号：US20240288363A1

公开(公告)日：2024-08-29

申请号：US18582173

申请日：2024-02-20

Applicant: Infineon Technologies AG

Inventor： Christoph Glacer ,  Ulrich Krumbein ,  Tobias Mittereder ,  Mark Pavier ,  Siyuan Qi ,  Hugh Richard ,  David Tumpold ,  Paul Westmarland

IPC: G01N21/3504

CPC classification number: G01N21/3504

Abstract: A package for an optical radiation device comprises a base structure having arranged thereon an optical radiation device, an optically transparent lid element bonded to the base structure defining a cavity between the base structure and the lid element, and a bond structure in a bonding region between the base structure and the lid element, wherein the bond structure is arranged to provide an adhesive bond between the base structure and the lid element, and wherein the bond structure comprises a diffusion layer having a gas diffusive material or gas diffusive structure for providing a gas diffusion path between the cavity and the surrounding atmosphere.

公开(公告)号：US20210172862A1

公开(公告)日：2021-06-10

申请号：US16951365

申请日：2020-11-18

Applicant: Infineon Technologies AG

Inventor： Siyuan Qi ,  Joachim Eder ,  Christoph Glacer ,  Dominic Maier ,  Mark Pavier

IPC: G01N21/17 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00

Abstract: The present disclosure concerns an emitter package for a photoacoustic sensor, the emitter package comprising a MEMS infrared radiation source for emitting pulsed infrared radiation in a first wavelength range. The MEMS infrared radiation source may be arranged on a substrate. The emitter package may further comprise a rigid wall structure being arranged on the substrate and laterally surrounding a periphery of the MEMS infrared radiation source. The emitter package may further comprise a lid structure being attached to the rigid wall structure, the lid structure comprising a filter structure for filtering the infrared radiation emitted from the MEMS infrared radiation source and for providing a filtered infrared radiation in a reduced second wavelength range.

公开(公告)号：US11609180B2

公开(公告)日：2023-03-21

申请号：US16951365

申请日：2020-11-18

Applicant: Infineon Technologies AG

Inventor： Siyuan Qi ,  Joachim Eder ,  Christoph Glacer ,  Dominic Maier ,  Mark Pavier

IPC: G01N21/17 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00

Abstract: The present disclosure concerns an emitter package for a photoacoustic sensor, the emitter package comprising a MEMS infrared radiation source for emitting pulsed infrared radiation in a first wavelength range. The MEMS infrared radiation source may be arranged on a substrate. The emitter package may further comprise a rigid wall structure being arranged on the substrate and laterally surrounding a periphery of the MEMS infrared radiation source. The emitter package may further comprise a lid structure being attached to the rigid wall structure, the lid structure comprising a filter structure for filtering the infrared radiation emitted from the MEMS infrared radiation source and for providing a filtered infrared radiation in a reduced second wavelength range.