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公开(公告)号：US11024565B2
公开(公告)日：2021-06-01
申请号：US16382508
申请日：2019-04-12
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L21/48 , H01L21/56
摘要： A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
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公开(公告)号：US10297536B2
公开(公告)日：2019-05-21
申请号：US15605093
申请日：2017-05-25
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.
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公开(公告)号：US09704786B2
公开(公告)日：2017-07-11
申请号：US14866050
申请日：2015-09-25
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.
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公开(公告)号：US20190237396A1
公开(公告)日：2019-08-01
申请号：US16382508
申请日：2019-04-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/31 , H01L21/48
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L24/00 , H01L2224/45014 , H01L2224/48247 , H01L2224/85011 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/206 , H01L2224/45099
摘要： A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
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公开(公告)号：US20170271245A1
公开(公告)日：2017-09-21
申请号：US15605093
申请日：2017-05-25
IPC分类号： H01L23/31 , H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.
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公开(公告)号：US20170092569A1
公开(公告)日：2017-03-30
申请号：US14866050
申请日：2015-09-25
IPC分类号： H01L23/495 , H01L21/56 , H01L21/48
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.
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