-
公开(公告)号：US11239176B2
公开(公告)日：2022-02-01
申请号：US16835627
申请日：2020-03-31
发明人： Jochen Dangelmaier , Klaus Elian
IPC分类号： H01L23/544 , H01L23/495
摘要： A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
-
公开(公告)号：US10297536B2
公开(公告)日：2019-05-21
申请号：US15605093
申请日：2017-05-25
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.
-
公开(公告)号：US09704786B2
公开(公告)日：2017-07-11
申请号：US14866050
申请日：2015-09-25
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.
-
公开(公告)号：US20150279782A1
公开(公告)日：2015-10-01
申请号：US14735604
申请日：2015-06-10
发明人： Henrik Ewe , Joachim Mahler , Manfred Mengel , Reimund Engl , Josef Hoeglauer , Jochen Dangelmaier
IPC分类号： H01L23/538 , H01L23/495 , H01L21/288 , H01L21/768 , H01L21/02 , H01L21/311 , H01L23/31 , H01L23/498
CPC分类号： H01L23/5389 , H01L21/02282 , H01L21/02288 , H01L21/288 , H01L21/31105 , H01L21/4821 , H01L21/6835 , H01L21/76801 , H01L21/76871 , H01L21/76877 , H01L23/3107 , H01L23/49524 , H01L23/49534 , H01L23/49541 , H01L23/49562 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2221/68345 , H01L2224/24011 , H01L2224/2402 , H01L2224/24051 , H01L2224/24137 , H01L2224/24145 , H01L2224/24226 , H01L2224/24246 , H01L2224/24998 , H01L2224/32145 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/82001 , H01L2224/82039 , H01L2224/82101 , H01L2224/82102 , H01L2225/06568 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12032 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , H01L2924/00 , H05K3/4661
摘要： A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness.
-
公开(公告)号：US20150001646A1
公开(公告)日：2015-01-01
申请号：US13927865
申请日：2013-06-26
CPC分类号： H04R31/00 , B81B2201/0257 , B81B2207/092 , B81B2207/096 , B81C1/0023 , B81C1/00301 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/10158 , H01L2924/16195 , H04R1/086 , H04R19/005 , H04R19/04 , Y10T29/49121 , H01L2924/00014
摘要： A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.
摘要翻译： 提供了一种麦克风组件，其中预模具包括弯曲的引线框架和模具本体，其中模具主体被模制成至少部分地封装弯曲的引线框架以构建包括用于容纳麦克风的空腔的预模具，并且其中 预模具包括用于声波的透孔。
-
公开(公告)号：US11073572B2
公开(公告)日：2021-07-27
申请号：US16250747
申请日：2019-01-17
IPC分类号： H01L23/495 , G01R33/00 , G01R33/07 , H01L23/31 , H01L23/00
摘要： A current sensor device may include a routable molded lead frame that includes a molded substrate. The current sensor device may include a conductor and a semiconductor chip mounted to the molded substrate. The semiconductor chip may include a magnetic field sensor that is galvanically isolated from the conductor by the molded substrate and is configured to sense a magnetic field created by current flowing through the conductor. The current sensor device may include one or more leads configured to output a signal generated by the semiconductor chip. The one or more leads may be galvanically isolated from the conductor by the molded substrate.
-
公开(公告)号：US11024565B2
公开(公告)日：2021-06-01
申请号：US16382508
申请日：2019-04-12
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L21/48 , H01L21/56
摘要： A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
-
公开(公告)号：US10818805B2
公开(公告)日：2020-10-27
申请号：US16185837
申请日：2018-11-09
IPC分类号： H01L31/0216 , H01L31/18 , B81B7/02 , B81C1/00 , B81B7/00 , H01L31/0203 , H01L31/0232
摘要： A semiconductor sensor device includes a substrate including a first main face and a second main face opposite the first main face, a semiconductor element including a sensing region, the semiconductor element on the first main face of the substrate and being electrically coupled to the substrate, a lid on the first main face of the substrate and forming a cavity, wherein the semiconductor element is in the cavity, and a vapor deposited dielectric coating covering the semiconductor element and the first main face of the substrate, the vapor deposited dielectric coating having an opening over the sensing region, wherein the second main face of the substrate is at least partially free of the vapor deposited dielectric layer.
-
公开(公告)号：US20200335451A1
公开(公告)日：2020-10-22
申请号：US16835627
申请日：2020-03-31
发明人： Jochen Dangelmaier , Klaus Elian
IPC分类号： H01L23/544 , H01L21/67
摘要： A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
-
公开(公告)号：US20200013749A1
公开(公告)日：2020-01-09
申请号：US16572626
申请日：2019-09-17
发明人： Joachim Mahler , Michael Bauer , Jochen Dangelmaier , Reimund Engl , Johann Gatterbauer , Frank Hille , Michael Huettinger , Werner Kanert , Heinrich Koerner , Brigitte Ruehle , Francisco Javier Santos Rodriguez , Antonio Vellei
摘要： In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.
-
-
-
-
-
-
-
-
-
搜索结果
33 条记录 (耗时 0.017 秒)