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1.发明申请MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACTERISTICS 审中-公开具有增强的本地粘合特性的模制半导体封装公开(公告)号：US20160282212A1
公开(公告)日：2016-09-29
申请号：US14667858
申请日：2015-03-25
发明人： Sebastian Beer , Helmut Wietschorke , Jochen Dangelmaier , Horst Theuss , Bernhard Knott , Thomas Mueller , Andreas Allmeier
CPC分类号： G01L19/147 , G01L19/0084 , H01L21/56 , H01L23/3107 , H01L23/3142 , H01L23/49551 , H01L23/49575 , H01L23/49586 , H01L25/18 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00012
摘要： A molded semiconductor package includes a substrate having opposing first and second main surfaces, a semiconductor die attached to the first main surface of the substrate, an adhesion adapter attached to the second main surface of the substrate or a surface of the semiconductor die facing away from the substrate, and a mold compound encapsulating the semiconductor die, the adhesion adapter and at least part of the substrate. The adhesion adapter is configured to adapt adhesion properties of the mold compound to adhesion properties of the substrate or semiconductor die to which the adhesion adapter is attached, such that the mold compound more strongly adheres to the adhesion adapter than directly to the substrate or semiconductor die to which the adhesion adapter is attached. The adhesion adapter has a surface feature which strengthens the adhesion between the adhesion adapter and the mold compound.
摘要翻译： 模制的半导体封装包括具有相对的第一和第二主表面的基板，附接到基板的第一主表面的半导体管芯，附接到基板的第二主表面的粘合适配器或半导体管芯的远离 衬底和封装半导体管芯，粘合适配器和至少部分衬底的模具化合物。 粘合适配器被配置成使得模制化合物的粘合性能适应于粘合适配器所附着的基底或半导体管芯的粘合性能，使得模制化合物比直接连接到基底或半导体模具更强烈地粘附到粘合适配器 附着适配器附接到该装置。 粘合适配器具有加强粘合适配器和模具化合物之间的粘附的表面特征。
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公开(公告)号：US11024565B2
公开(公告)日：2021-06-01
申请号：US16382508
申请日：2019-04-12
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00 , H01L21/48 , H01L21/56
摘要： A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
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公开(公告)号：US10297536B2
公开(公告)日：2019-05-21
申请号：US15605093
申请日：2017-05-25
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.
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公开(公告)号：US09704786B2
公开(公告)日：2017-07-11
申请号：US14866050
申请日：2015-09-25
IPC分类号： H01L21/00 , H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.
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公开(公告)号：US20190237396A1
公开(公告)日：2019-08-01
申请号：US16382508
申请日：2019-04-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/31 , H01L21/48
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L24/00 , H01L2224/45014 , H01L2224/48247 , H01L2224/85011 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2924/00014 , H01L2924/206 , H01L2224/45099
摘要： A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
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公开(公告)号：US20170271245A1
公开(公告)日：2017-09-21
申请号：US15605093
申请日：2017-05-25
IPC分类号： H01L23/31 , H01L23/495 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.
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公开(公告)号：US20170092569A1
公开(公告)日：2017-03-30
申请号：US14866050
申请日：2015-09-25
IPC分类号： H01L23/495 , H01L21/56 , H01L21/48
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4835 , H01L21/56 , H01L23/3142 , H01L23/49524 , H01L23/49582 , H01L23/49586 , H01L2224/48247 , H01L2224/85011
摘要： A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.
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