公开(公告)号：US20230148014A1

公开(公告)日：2023-05-11

申请号：US17972910

申请日：2022-10-25

申请人： Infineon Technologies AG

发明人： Thomas Grille ,  Elmar Aschauer ,  Ulf Bartl ,  Christoph Kovatsch ,  Matic Krivec ,  Thomas Ostermann ,  Lukas Praster ,  Gerald Stocker

IPC分类号： H02N2/18 ,  H02N2/00

CPC分类号： H02N2/186 ,  H02N2/22

摘要： A MEMS component is described herein, which according to one exemplary embodiment includes: a semiconductor body; an insulation layer arranged on the semiconductor body; a boundary structure arranged on the insulation layer, the semiconductor body including an opening below the boundary structure; first and second structured electrodes arranged on the insulation layer; and a piezoelectric layer comprising a thermoplastic, and at least partially bounded by the boundary structure and arranged on the insulation layer and on the first and second electrodes.