公开(公告)号：US12140514B2

公开(公告)日：2024-11-12

申请号：US17658554

申请日：2022-04-08

Applicant: Infineon Technologies AG

Inventor： Gerald Stocker ,  Elmar Aschauer ,  Ulf Bartl ,  Thomas Grille ,  Christoph Kovatsch ,  Thomas Krotscheck Ostermann

IPC: G01N1/44 ,  G01K7/01 ,  G01N33/00

Abstract: A fluid sensor for performing a reference measurement includes a support structure having a top main surface region; a thermal emitter on the top main surface region of the support structure; a first waveguide section and a first thermal radiation detector on the top main surface region of the support structure; and a cover structure on at least one part of the first waveguide section. The first waveguide section guides a first portion of the thermal radiation emitted by the thermal emitter to the first thermal radiation detector. The first thermal radiation detector detects the guided first portion of the thermal radiation for performing the reference measurement.

公开(公告)号：US20220381753A1

公开(公告)日：2022-12-01

申请号：US17658564

申请日：2022-04-08

Applicant: Infineon Technologies AG

Inventor： Gerald Stocker ,  Elmar Aschauer ,  Ulf Bartl ,  Thomas Grille ,  Christoph Kovatsch ,  Thomas Krotscheck Ostermann

IPC: G01N33/00 ,  G01K7/01 ,  G01N1/44

Abstract: A fluid sensor includes a support structure having a top main surface region; a thermal emitter on the top main surface region of the support structure; a thermal radiation detector on the top main surface region of the support structure; and a waveguide structure having a first and a second waveguide section on the top main surface region of the support structure. The first waveguide section guides a first portion of the thermal radiation to the thermal radiation detector and the second waveguide section guides a second portion of the thermal radiation to the thermal radiation detector. The waveguide structure enables an interaction of an evanescence field of the guided first and/or second portion of the thermal radiation with a surrounding fluid.

公开(公告)号：US20230296502A1

公开(公告)日：2023-09-21

申请号：US18166905

申请日：2023-02-09

Applicant: Infineon Technologies AG

Inventor： Christoph Kovatsch ,  Elmar Aschauer ,  Ulf Bartl ,  Thomas Grille ,  Thomas Krotscheck Ostermann ,  Gerald Stocker

IPC: G01N21/3504 ,  G01N23/20008 ,  H01L21/02

CPC classification number: G01N21/3504 ,  G01N23/20008 ,  H01L21/02002 ,  G01N2201/068

Abstract: A monolithic fluid sensor system includes a sensor arrangement and a reference sensor arrangement that are monolithically arranged, wherein respective substrates or semiconductor substrates (wafers or semiconductor wafers) are bonded (fusion bonded or wafer bonded on wafer-level) to each other for providing the resulting monolithic fluid sensor system. The monolithic fluid sensor system particularly includes the sensor arrangement, a cover substrate, the reference sensor arrangement, and a reference cover substrate.

公开(公告)号：US12235170B2

公开(公告)日：2025-02-25

申请号：US17658564

申请日：2022-04-08

Applicant: Infineon Technologies AG

Inventor： Gerald Stocker ,  Elmar Aschauer ,  Ulf Bartl ,  Thomas Grille ,  Christoph Kovatsch ,  Thomas Krotscheck Ostermann

IPC: G01N33/00 ,  G01J5/02 ,  G01J5/0802 ,  G01J5/0818 ,  G01J5/10 ,  G01K7/01 ,  G01N21/3504

Abstract: A fluid sensor includes a support structure having a top main surface region; a thermal emitter on the top main surface region of the support structure; a thermal radiation detector on the top main surface region of the support structure; and a waveguide structure having a first and a second waveguide section on the top main surface region of the support structure. The first waveguide section guides a first portion of the thermal radiation to the thermal radiation detector and the second waveguide section guides a second portion of the thermal radiation to the thermal radiation detector. The waveguide structure enables an interaction of an evanescence field of the guided first and/or second portion of the thermal radiation with a surrounding fluid.

公开(公告)号：US20230148014A1

公开(公告)日：2023-05-11

申请号：US17972910

申请日：2022-10-25

Applicant: Infineon Technologies AG

Inventor： Thomas Grille ,  Elmar Aschauer ,  Ulf Bartl ,  Christoph Kovatsch ,  Matic Krivec ,  Thomas Ostermann ,  Lukas Praster ,  Gerald Stocker

IPC: H02N2/18 ,  H02N2/00

CPC classification number: H02N2/186 ,  H02N2/22

Abstract: A MEMS component is described herein, which according to one exemplary embodiment includes: a semiconductor body; an insulation layer arranged on the semiconductor body; a boundary structure arranged on the insulation layer, the semiconductor body including an opening below the boundary structure; first and second structured electrodes arranged on the insulation layer; and a piezoelectric layer comprising a thermoplastic, and at least partially bounded by the boundary structure and arranged on the insulation layer and on the first and second electrodes.

公开(公告)号：US20220381659A1

公开(公告)日：2022-12-01

申请号：US17658554

申请日：2022-04-08

Applicant: Infineon Technologies AG

Inventor： Gerald Stocker ,  Elmar Aschauer ,  Ulf Bartl ,  Thomas Grille ,  Christoph Kovatsch ,  Thomas Krotscheck Ostermann

IPC: G01N1/44 ,  G01N33/00 ,  G01K7/01

Abstract: A fluid sensor for performing a reference measurement includes a support structure having a top main surface region; a thermal emitter on the top main surface region of the support structure; a first waveguide section and a first thermal radiation detector on the top main surface region of the support structure; and a cover structure on at least one part of the first waveguide section. The first waveguide section guides a first portion of the thermal radiation emitted by the thermal emitter to the first thermal radiation detector. The first thermal radiation detector detects the guided first portion of the thermal radiation for performing the reference measurement.