公开(公告)号：US20230274996A1

公开(公告)日：2023-08-31

申请号：US18105309

申请日：2023-02-03

Applicant: Infineon Technologies AG

Inventor： Stefan SCHWAB ,  Edward FÜRGUT ,  Edmund RIEDL ,  Harry SAX ,  Stefan KRIVEC ,  Manfred PFAFFENLEHNER ,  Carsten SCHAEFFER

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3192 ,  H01L21/56 ,  H01L23/3135 ,  H01L24/02 ,  H01L24/05 ,  H01L23/291

Abstract: A chip arrangement is provided. The chip arrangement may include a chip including a first main surface, wherein the first main surface includes an active area, a chip termination portion, and at least one contact pad. A first dielectric layer at least partially covers the chip termination portion and the active area, and at least partially exposes the at least one contact pad, and a second dielectric layer formed by atomic layer deposition over the first dielectric layer and over the at least one contact pad.