公开(公告)号：US20220108949A1

公开(公告)日：2022-04-07

申请号：US17064954

申请日：2020-10-07

Applicant: Infineon Technologies AG

Inventor： Lee Shuang WANG ,  Thai Kee GAN ,  Teck Sim LEE

IPC: H01L23/528 ,  H01L23/31 ,  H01L43/04 ,  G01R33/09 ,  G01R33/07

Abstract: One example of a semiconductor package includes a first die pad, a first die, a second die pad, and a second die. The first die pad includes a main portion and a U-shaped rail portion extending from the main portion. The first die is electrically coupled to the first die pad. The second die pad is proximate the U-shaped rail portion of the first die pad. The second die is electrically coupled to the second die pad. The second die includes a magnetic field sensor.

公开(公告)号：US20240347427A1

公开(公告)日：2024-10-17

申请号：US18598163

申请日：2024-03-07

Applicant: Infineon Technologies AG

Inventor： Edward FÜRGUT ,  Teck Sim LEE ,  Guey Yong CHEE ,  Thai Kee GAN ,  Thomas BEMMERL ,  Markus FINK

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L23/49555 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/08 ,  H01L25/072 ,  H01L2224/08221 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: A leadframe is disclosed. In one example, the leadframe comprises a die pad and a first lead comprising an inner portion and an external portion. The first lead comprises at least one elevation portion extending over a predetermined length in a longitudinal or lateral direction of the first lead. The external portion is configured to be used for external electrical connection. In another example, a semiconductor package having a leadframe is disclosed.

公开(公告)号：US20220157682A1

公开(公告)日：2022-05-19

申请号：US17502082

申请日：2021-10-15

Applicant: Infineon Technologies AG

Inventor： Edward FUERGUT ,  Chii Shang HONG ,  Teck Sim LEE ,  Bernd SCHMOELZER ,  Ke Yan TEAN ,  Lee Shuang WANG

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/56

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

公开(公告)号：US20240395646A1

公开(公告)日：2024-11-28

申请号：US18792129

申请日：2024-08-01

Applicant: Infineon Technologies AG

Inventor： Edward FUERGUT ,  Chii Shang HONG ,  Teck Sim LEE ,  Bernd SCHMOELZER ,  Ke Yan TEAN ,  Lee Shuang WANG

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/495 ,  H01L23/498

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

公开(公告)号：US20240038612A1

公开(公告)日：2024-02-01

申请号：US18380276

申请日：2023-10-16

Applicant: Infineon Technologies AG

Inventor： Edward FUERGUT ,  Chii Shang HONG ,  Teck Sim LEE ,  Bernd SCHMOELZER ,  Ke Yan TEAN ,  Lee Shuang WANG

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L23/49555 ,  H01L23/49537 ,  H01L21/56 ,  H01L23/49568 ,  H01L23/49541 ,  H01L24/46 ,  H01L24/83 ,  H01L23/49506 ,  H01L23/49551 ,  H01L23/49838 ,  H01L24/49 ,  H01L23/49503 ,  H01L23/49575 ,  H01L2924/181

Abstract: A package is disclosed. In one example, the package includes a first main face for mounting a heat sink and an opposing second main face for being mounted on a mounting base. The package comprises a carrier, an electronic component mounted at the carrier, and an encapsulant encapsulating at least part of the electronic component and at least part of the carrier. Electrically insulating material covers electrically conductive material of the carrier at said first main face. The encapsulant comprises at least one step at the first main face.

公开(公告)号：US20190074243A1

公开(公告)日：2019-03-07

申请号：US15694086

申请日：2017-09-01

Applicant: Infineon Technologies AG

Inventor： Rainald SANDER ,  Liu CHEN ,  Teck Sim LEE

IPC: H01L23/495 ,  H01L23/00

Abstract: A package which comprises an electrically conductive chip carrier, a first chip comprising a first connection terminal, a second connection terminal located on the chip carrier and a control terminal, a second chip comprising a first connection terminal, a second connection terminal located on the chip carrier and a control terminal, wherein the first chip and the second chip are connected to form a half bridge having inlet terminals and an outlet terminal, and a clip having three connection sections connecting the second connection terminal of the first chip with the first connection terminal of the second chip and with the outlet terminal of the half bridge.

公开(公告)号：US20230361009A1

公开(公告)日：2023-11-09

申请号：US18195178

申请日：2023-05-09

Applicant: Infineon Technologies AG

Inventor： Lee Shuang WANG ,  Marta ALOMAR DOMINGUEZ ,  Marcus BÖHM ,  Edward FÜRGUT ,  Chii Shang HONG ,  Teck Sim LEE ,  Bernd SCHMOELZER

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

CPC classification number: H01L23/49562 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/40 ,  H01L25/072 ,  H01L2224/40175

Abstract: A semiconductor package is disclosed. In one example, the semiconductor package comprises a package body and a second die pad at least partially encapsulated in the package body. A first semiconductor die is at least partially encapsulated in the package body and arranged on the first die pad. A further device at least partially encapsulated in the package body and arranged on the second die pad. At least one first lead is connected with the first contact pad of the first semiconductor die. At least one second lead is connected with the second contact pad of the further device. An electrical conductor is connected between the at least one first lead and the at least one second lead, the electrical conductor being completely encapsulated in the package body.