公开(公告)号：US11903132B2

公开(公告)日：2024-02-13

申请号：US18122988

申请日：2023-03-17

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Martin Benisek ,  Liu Chen ,  Frank Daeche ,  Josef Maerz

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/021 ,  H05K1/0298 ,  H05K1/0306

Abstract: A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a laminate inlay embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the laminate inlay and configured to distribute a load current switched by the laminate inlay. A fourth metal layer is positioned between the second metal layer and the laminate inlay and configured as a primary thermal conduction path for heat generated by the laminate inlay during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.

公开(公告)号：US20210127490A1

公开(公告)日：2021-04-29

申请号：US16663947

申请日：2019-10-25

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Martin Benisek ,  Liu Chen ,  Frank Daeche ,  Josef Maerz

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03

Abstract: A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a power device embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the power device and configured to distribute a load current switched by the power device. A fourth metal layer is positioned between the second metal layer and the power device and configured as a primary thermal conduction path for heat generated by the power device during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.

公开(公告)号：US20240312799A1

公开(公告)日：2024-09-19

申请号：US18122895

申请日：2023-03-17

Applicant: Infineon Technologies AG

Inventor： Robert Fehler ,  Angela Kessler ,  Kushal Kshirsagar ,  Emanuele Bodano ,  Martin Benisek

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/538

CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/5383 ,  H01L23/5385 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1815

Abstract: A semiconductor package includes a laminate package substrate, first and second power transistor dies embedded within the laminate package substrate, a driver die embedded within the laminate package substrate, a plurality of I/O routings electrically connected with I/O terminals of the driver die, a switching signal pad electrically connected with a second load terminal of the first power transistor die and a first load terminal of the second power transistor die, and a shielding pad that is configured to electrically shield at least one of the I/O routings from the switching signal pad during operation of the first and second power transistor dies.

公开(公告)号：US11632860B2

公开(公告)日：2023-04-18

申请号：US16663947

申请日：2019-10-25

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Martin Benisek ,  Liu Chen ,  Frank Daeche ,  Josef Maerz

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03

Abstract: A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a power device embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the power device and configured to distribute a load current switched by the power device. A fourth metal layer is positioned between the second metal layer and the power device and configured as a primary thermal conduction path for heat generated by the power device during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.

公开(公告)号：US20230240012A1

公开(公告)日：2023-07-27

申请号：US18122988

申请日：2023-03-17

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Martin Benisek ,  Liu Chen ,  Frank Daeche ,  Josef Maerz

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/021 ,  H05K1/0298 ,  H05K1/0306

Abstract: A power electronic assembly includes a board having metal layers laminated onto or between electrically insulating layers, and a laminate inlay embedded in the board. A first metal layer provides electrical contacts at a first side of the board. A second metal layer provides a thermal contact at a second side of the board. A third metal layer is positioned between the first metal layer and the laminate inlay and configured to distribute a load current switched by the laminate inlay. A fourth metal layer is positioned between the second metal layer and the laminate inlay and configured as a primary thermal conduction path for heat generated by the laminate inlay during switching of the load current. A first electrically insulating layer separates the fourth metal layer from the second metal layer so that the fourth metal layer is electrically isolated from but thermally connected to the second metal layer.