公开(公告)号：US20240105564A1

公开(公告)日：2024-03-28

申请号：US18529308

申请日：2023-12-05

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Joel Feliciano Del Rosario ,  Thai Kee Gan ,  Mohd Afiz Hashim ,  Mei Fen Hiew

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/532

CPC classification number: H01L23/49575 ,  H01L23/49562 ,  H01L23/53228 ,  H01L24/40 ,  H01L2224/37147

Abstract: A semiconductor package includes: a semiconductor die attached to a leadframe and having a first bond pad at a side of the semiconductor die facing away from the leadframe; a metal clip having a first bonding region attached to the first bond pad of the semiconductor die by a plurality of first wire bonds which extend through a plurality of first openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die; and a joint between the plurality of first wire bonds and the metal clip at a side of the metal clip facing away from the semiconductor die. Additional semiconductor package embodiments and related methods of manufacture are also described.

公开(公告)号：US20240250056A1

公开(公告)日：2024-07-25

申请号：US18098979

申请日：2023-01-19

Applicant: Infineon Technologies AG

Inventor： Mohd Afiz Hashim ,  Zhi Yuan Goh ,  Subaramaniym Senivasan ,  Azmil Abdullah ,  Varun Parthasarathy ,  Kah Wai Lau ,  Ahmad Zulkarnain Samsudin

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/40 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/05 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05005 ,  H01L2224/40175 ,  H01L2224/48247 ,  H01L2224/73271 ,  H01L2924/01029 ,  H01L2924/014

Abstract: A semiconductor package includes: a substrate having a metallic surface; a semiconductor die metallurgically bonded to the metallic surface of the substrate by a first solder joint; and a solder wetting structure metallurgically welded to the metallic surface of the substrate outside a perimeter of the semiconductor die and adjacent to one or more side faces of the semiconductor die. Excess solder squeezed out from under the semiconductor die is metallurgically bonded to the solder wetting structure. Methods of producing the semiconductor package and solder wetting structure are also described.

公开(公告)号：US11842953B2

公开(公告)日：2023-12-12

申请号：US17243056

申请日：2021-04-28

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Joel Feliciano Del Rosario ,  Thai Kee Gan ,  Mohd Afiz Hashim ,  Mei Fen Hiew

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/532 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/49562 ,  H01L23/53228 ,  H01L24/40 ,  H01L2224/37147

Abstract: A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality of first wire bonds to the first bond pad of the semiconductor die through a plurality of openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die. Additional methods and related semiconductor packages produced from such methods are also described.

公开(公告)号：US12205874B2

公开(公告)日：2025-01-21

申请号：US18529308

申请日：2023-12-05

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Joel Feliciano Del Rosario ,  Thai Kee Gan ,  Mohd Afiz Hashim ,  Mei Fen Hiew

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/495 ,  H01L23/532

Abstract: A semiconductor package includes: a semiconductor die attached to a leadframe and having a first bond pad at a side of the semiconductor die facing away from the leadframe; a metal clip having a first bonding region attached to the first bond pad of the semiconductor die by a plurality of first wire bonds which extend through a plurality of first openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die; and a joint between the plurality of first wire bonds and the metal clip at a side of the metal clip facing away from the semiconductor die. Additional semiconductor package embodiments and related methods of manufacture are also described.

公开(公告)号：US20220352056A1

公开(公告)日：2022-11-03

申请号：US17243056

申请日：2021-04-28

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Joel Feliciano Del Rosario ,  Thai Kee Gan ,  Mohd Afiz Hashim ,  Mei Fen Hiew

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/532

Abstract: A method of attaching a metal clip to a semiconductor die includes: aligning a first bonding region of the metal clip with a first bond pad of the semiconductor die; and while the first bonding region of the metal clip is aligned with the first bond pad of the semiconductor die, forming a plurality of first wire bonds to the first bond pad of the semiconductor die through a plurality of openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die. Additional methods and related semiconductor packages produced from such methods are also described.