公开(公告)号：US10418343B2

公开(公告)日：2019-09-17

申请号：US15832336

申请日：2017-12-05

Applicant: Infineon Technologies AG

Inventor： Hui Teng Wang ,  Swain Hong Yeo

IPC: H01L25/065 ,  H01L23/495 ,  H01L23/31 ,  H01L23/367 ,  H01L25/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package includes a second leadframe assembly stacked above a first leadframe assembly, each leadframe assembly including a die pad, a plurality of leads and a semiconductor die attached to the die pad and electrically connected to the leads. A spacer separates the leadframe assemblies from one another. A single mold compound embeds part of the first leadframe assembly, part of the second leadframe assembly and the spacer. A portion of the leads of both leadframe assemblies are uncovered by the mold compound to form terminals of the semiconductor package. A side of both die pads is uncovered by the mold compound.

公开(公告)号：US10861828B2

公开(公告)日：2020-12-08

申请号：US16520872

申请日：2019-07-24

Applicant: Infineon Technologies AG

Inventor： Hui Teng Wang ,  Swain Hong Yeo

IPC: H01L25/065 ,  H01L23/495 ,  H01L23/31 ,  H01L23/367 ,  H01L25/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor package includes a second leadframe assembly stacked above a first leadframe assembly, each leadframe assembly including a die pad, a plurality of leads and a semiconductor die attached to the die pad and electrically connected to the leads. An electrically insulative spacer separates the first and the second leadframe assemblies from one another. A mold compound embeds part of the first leadframe assembly, part of the second leadframe assembly and the electrically insulative spacer.

公开(公告)号：US20190172815A1

公开(公告)日：2019-06-06

申请号：US15832336

申请日：2017-12-05

Applicant: Infineon Technologies AG

Inventor： Hui Teng Wang ,  Swain Hong Yeo

IPC: H01L25/065 ,  H01L23/495 ,  H01L23/31 ,  H01L23/367 ,  H01L25/00 ,  H01L21/78 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package includes a second leadframe assembly stacked above a first leadframe assembly, each leadframe assembly including a die pad, a plurality of leads and a semiconductor die attached to the die pad and electrically connected to the leads. A spacer separates the leadframe assemblies from one another. A single mold compound embeds part of the first leadframe assembly, part of the second leadframe assembly and the spacer. A portion of the leads of both leadframe assemblies are uncovered by the mold compound to form terminals of the semiconductor package. A side of both die pads is uncovered by the mold compound.