利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.011 秒)

    ACOUSTIC SENSOR PACKAGE
    3.
    发明申请
    ACOUSTIC SENSOR PACKAGE 有权
    声学传感器包装

    公开(公告)号：US20140254850A1

    公开(公告)日：2014-09-11

    申请号：US13786559

    申请日：2013-03-06

    申请人： INFINEON TECHNOLOGIES AG

    发明人： Klaus ELIAN ,  Thomas MUELLER

    IPC分类号： H04R1/02 ,  H04R31/00

    CPC分类号： H04R17/025 ,  H04R3/005 ,  H04R31/00 ,  H04R2420/07 ,  H04R2499/13 ,  Y10T29/49005

    摘要： Representative implementations of devices and techniques provide an improved signal receive time to a sensor component. The sensor component is enclosed within a package arranged to allow the sensor to potentially receive a signal in less time. The package may have a cavity, and the cavity may be at least partly filled with an acoustical transducer.

    摘要翻译： 设备和技术的代表性实现为传感器组件提供了改进的信号接收时间。 传感器部件被封装在一个封装中，该封装被布置成允许传感器潜在地在更短的时间内接收信号。 封装可以具有空腔，并且空腔可以至少部分地填充有声换能器。

    INDUCTIVE ANGLE AND/OR POSITION SENSOR
    4.
    发明申请
    INDUCTIVE ANGLE AND/OR POSITION SENSOR 有权

    公开(公告)号：US20210190543A1

    公开(公告)日：2021-06-24

    申请号：US17247665

    申请日：2020-12-18

    申请人： Infineon Technologies AG

    发明人： Udo AUSSERLECHNER ,  Horst THEUSS ,  Thomas MUELLER

    IPC分类号： G01D5/20

    摘要： The present disclosure relates to an inductive angle and/or position sensor comprising a first sensor component and a second sensor component, which is movable relative thereto, wherein the first sensor component comprises an excitation coil and a receiving coil arrangement having two or more individual receiving coils, and wherein the second sensor component comprises an inductive target. The first sensor component comprises a semiconductor chip having an integrated circuit. The sensor comprises a housing, in which the semiconductor chip is arranged. The individual receiving coils of the receiving coil arrangement are configured in at least two structured metallization layers spaced apart from one another, which are arranged within the housing and/or outside on an outer surface of the housing.

    PHOTOACOUSTIC GAS SENSOR PACKAGE
    5.
    发明申请
    PHOTOACOUSTIC GAS SENSOR PACKAGE 审中-公开

    公开(公告)号：US20200018731A1

    公开(公告)日：2020-01-16

    申请号：US16036484

    申请日：2018-07-16

    申请人： Infineon Technologies AG

    发明人： Horst THEUSS ,  Rainer Markus SCHALLER ,  Thomas MUELLER

    IPC分类号： G01N29/24 ,  G01N29/30 ,  G01N21/17

    摘要： A photoacoustic sensor device may include a housing and first and second ceramic cavity packages disposed in the housing. The first ceramic cavity package may include a first sidewall having a first set of electrical contact elements, a first cavity structure, and a light source electrically coupled to the first set of electrical contact elements. The second ceramic cavity package may include a second sidewall having a second set of electrical contact elements, a second cavity structure, and a photoacoustic detector electrically coupled to the second set of electrical contact elements. The first and second ceramic cavity packages may be arranged such that the light source and the photoacoustic detector face one another, and oriented such that the first and second sets of electrical contact elements align with electrical contact points of a PCB when the photoacoustic sensor device is positioned over the PCB for coupling to the PCB.