公开(公告)号：US20230298989A1

公开(公告)日：2023-09-21

申请号：US18182476

申请日：2023-03-13

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Frank Püschner ,  Thomas Spöttl ,  Uwe Wagner

IPC: H01L23/498 ,  H01L23/485 ,  H01L21/56 ,  H01L23/66 ,  G06K19/077

CPC classification number: H01L23/49855 ,  H01L23/485 ,  H01L21/56 ,  H01L23/66 ,  G06K19/07722 ,  H01L2223/6677

Abstract: A chip-interconnect arrangement including a substrate having a cavity, a chip having at least one chip contact and one chip contact surface, the chip being arranged in the cavity, an interconnect having an interconnect surface, the interconnect being applied on a surface of the substrate, and an electrically conductive adhesion medium, which electrically connects the at least one chip contact to the interconnect, wherein the interconnect surface is planar.

公开(公告)号：US20240078406A1

公开(公告)日：2024-03-07

申请号：US18453055

申请日：2023-08-21

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Michael Huber ,  Frank Püschner ,  Thomas Spöttl

IPC: G06K19/077 ,  H01L23/498

CPC classification number: G06K19/0775 ,  G06K19/07743 ,  G06K19/07747 ,  H01L23/49855

Abstract: A chip arrangement including a chip module which includes a chip, a contact-based interface in accordance with ISO 7816 which is electrically conductively connected to the chip, and an antenna structure which is electrically conductively connected to the chip and provides a contactless interface, and a carrier which comprises a chip module receptacle and a booster antenna structure which, when the chip module is arranged in the chip module receptacle of the carrier, inductively couples to the antenna structure of the chip module, wherein the chip module is arranged releasably in the chip module receptacle.

公开(公告)号：US20240298714A1

公开(公告)日：2024-09-12

申请号：US18668518

申请日：2024-05-20

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Thea Goetz ,  Frank Püschner ,  Thomas Spöttl

IPC: A24F40/53 ,  A24F40/10 ,  A24F40/65 ,  A24F40/70

CPC classification number: A24F40/53 ,  A24F40/10 ,  A24F40/65 ,  A24F40/70

Abstract: An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure which, when a chip module is accommodated in the chip module accommodating region, is bent around the chip module in order to fasten the chip module, wherein the folding structure has a folding region on at least one side of the chip module accommodating region extending a length that is less than a length of the respective side of the chip module accommodating region.

公开(公告)号：US20230289554A1

公开(公告)日：2023-09-14

申请号：US18182468

申请日：2023-03-13

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Frank Püschner ,  Thomas Spöttl ,  Peter Stampka

IPC: G06K19/077

CPC classification number: G06K19/07747

Abstract: A smart card module including a contact region with at least one electrical smart card module contact, and a verification code display unit configured to display a verification code, the verification code display unit being arranged in the smart card module, wherein the verification code display unit is configured as a dynamic permanent display unit, the controlled display of which continues to be displayed after deenergization of the verification code display unit.