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公开(公告)号：US20240298714A1
公开(公告)日：2024-09-12
申请号：US18668518
申请日：2024-05-20
发明人： Jens Pohl , Thea Goetz , Frank Püschner , Thomas Spöttl
摘要： An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure which, when a chip module is accommodated in the chip module accommodating region, is bent around the chip module in order to fasten the chip module, wherein the folding structure has a folding region on at least one side of the chip module accommodating region extending a length that is less than a length of the respective side of the chip module accommodating region.
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公开(公告)号：US20240202485A1
公开(公告)日：2024-06-20
申请号：US18524353
申请日：2023-11-30
发明人： Frank Püschner , Mark Pavier , Bernd Ebersberger
IPC分类号： G06K19/077 , G06K19/07 , G06V40/13
CPC分类号： G06K19/07756 , G06K19/0718 , G06K19/07775 , G06V40/1306
摘要： A wafer-level package sensor device including a capacitive sensor, a controller which is electrically conductively connected to the sensor, wherein the capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device formed in different planes, and multiple contact surfaces connected to the controller, which are configured to electrically couple to a chip card module carrier using a flip-chip connection.
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公开(公告)号：US20230289554A1
公开(公告)日：2023-09-14
申请号：US18182468
申请日：2023-03-13
发明人： Jens Pohl , Frank Püschner , Thomas Spöttl , Peter Stampka
IPC分类号： G06K19/077
CPC分类号： G06K19/07747
摘要： A smart card module including a contact region with at least one electrical smart card module contact, and a verification code display unit configured to display a verification code, the verification code display unit being arranged in the smart card module, wherein the verification code display unit is configured as a dynamic permanent display unit, the controlled display of which continues to be displayed after deenergization of the verification code display unit.
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公开(公告)号：US09324642B2
公开(公告)日：2016-04-26
申请号：US14077582
申请日：2013-11-12
发明人： Frank Püschner , Bernhard Schätzler , Teck Sim Lee , Franz Gabler , Pei Pei Kong , Boon Huat Lim
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4828 , H01L21/561 , H01L22/14 , H01L23/3107 , H01L23/49575 , H01L23/49582 , H01L24/97 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.
摘要翻译： 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 将半导体管芯附接到管芯片。 模制化合物覆盖包括半导体管芯的单元引线框架。 在引线框架条的测试或其它处理之前，间隙被蚀刻到由相邻单元引线框架共享的引线的区域中。 差距至少主要通过共享潜在客户。 在随后的处理之前，在包括在共享引线之间的间隙的下方的单元引线框的周围的模塑料中部分地切割，以使单元引线框架的引线电隔离。
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5.发明公开公开(公告)号：US20240078406A1
公开(公告)日：2024-03-07
申请号：US18453055
申请日：2023-08-21
发明人： Jens Pohl , Michael Huber , Frank Püschner , Thomas Spöttl
IPC分类号： G06K19/077 , H01L23/498
CPC分类号： G06K19/0775 , G06K19/07743 , G06K19/07747 , H01L23/49855
摘要： A chip arrangement including a chip module which includes a chip, a contact-based interface in accordance with ISO 7816 which is electrically conductively connected to the chip, and an antenna structure which is electrically conductively connected to the chip and provides a contactless interface, and a carrier which comprises a chip module receptacle and a booster antenna structure which, when the chip module is arranged in the chip module receptacle of the carrier, inductively couples to the antenna structure of the chip module, wherein the chip module is arranged releasably in the chip module receptacle.
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公开(公告)号：US20230187328A1
公开(公告)日：2023-06-15
申请号：US18062164
申请日：2022-12-06
发明人： Jens Pohl , Frank Püschner
IPC分类号： H01L23/498 , H01L21/56 , G06K19/077 , H05K3/34 , H05K1/11
CPC分类号： H01L23/49805 , H01L21/563 , G06K19/07722 , H05K3/3431 , H05K1/111 , G06V40/13
摘要： A package including an electronic leadless module having a top side, a bottom side and side faces between the top side and the bottom side, the electronic leadless module having an electronic circuit, a plurality of electrical contact pads at the bottom side of the electronic leadless module which are electrically conductively coupled to the electronic circuit, and encapsulation material which partially encapsulates the electronic circuit, wherein the electrical contact pads are at least partially free from encapsulation material and the electronic leadless module have an anchoring region on at least one side face. The package may also include a carrier frame which carries the electronic leadless module, with the side face extending further in the direction of the carrier frame below the anchoring region than in the anchoring region, and filler material in the anchoring region for fastening the electronic leadless module to the carrier frame.
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公开(公告)号：US20230361076A1
公开(公告)日：2023-11-09
申请号：US18303177
申请日：2023-04-19
发明人： Hermann Bechert , Andreas Beer , Frank Püschner
IPC分类号： H01L23/00 , H01L23/498
CPC分类号： H01L24/83 , H01L24/32 , H01L23/49866 , H01L24/29 , H01L2224/83851 , H01L2224/83862 , H01L2224/83906 , H01L2224/83815 , H01L2224/83203 , H01L2224/32225 , H01L2224/29355 , H01L2224/29113 , H01L2224/29111 , H01L2224/2929 , H01L2924/07811
摘要： A chip arrangement including a carrier, a chip having at least one chip pad, and a bonding agent to fasten the chip pad on the carrier, the bonding agent having solder material and an anisotropic conductive adhesive.
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公开(公告)号：US20230298989A1
公开(公告)日：2023-09-21
申请号：US18182476
申请日：2023-03-13
发明人： Jens Pohl , Frank Püschner , Thomas Spöttl , Uwe Wagner
IPC分类号： H01L23/498 , H01L23/485 , H01L21/56 , H01L23/66 , G06K19/077
CPC分类号： H01L23/49855 , H01L23/485 , H01L21/56 , H01L23/66 , G06K19/07722 , H01L2223/6677
摘要： A chip-interconnect arrangement including a substrate having a cavity, a chip having at least one chip contact and one chip contact surface, the chip being arranged in the cavity, an interconnect having an interconnect surface, the interconnect being applied on a surface of the substrate, and an electrically conductive adhesion medium, which electrically connects the at least one chip contact to the interconnect, wherein the interconnect surface is planar.
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公开(公告)号：US20150130037A1
公开(公告)日：2015-05-14
申请号：US14077582
申请日：2013-11-12
发明人： Frank Püschner , Bernhard Schätzler , Teck Sim Lee , Franz Gabler , Pei Pei Kong , Boon Huat Lim
IPC分类号： H01L23/495 , H01L21/48 , H01L21/66
CPC分类号： H01L23/49541 , H01L21/4825 , H01L21/4828 , H01L21/561 , H01L22/14 , H01L23/3107 , H01L23/49575 , H01L23/49582 , H01L24/97 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/00
摘要： A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.
摘要翻译： 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 将半导体管芯附接到管芯片。 模制化合物覆盖包括半导体管芯的单元引线框架。 在引线框架条的测试或其它处理之前，间隙被蚀刻到由相邻单元引线框架共享的引线的区域中。 差距至少主要通过共享潜在客户。 在随后的处理之前，在包括在共享引线之间的间隙的下方的单元引线框的周围的模塑料中进行部分切割以使单元引线框架的引线电隔离。
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