公开(公告)号：US20150132868A1

公开(公告)日：2015-05-14

申请号：US14077742

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/48 ,  H01L21/66

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles and covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles. Spaced apart cuts are formed in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts. The lead frame strip is processed after the cuts are formed, and the unit lead frames are later separated into individual packages.

Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 通过在将半导体管芯附接到管芯焊盘上之后，通过将半导体管芯附接到每个管芯焊盘并且用模制化合物覆盖单元引线框架来处理引线框架条。 在每个单元引线框架的周边形成间隔开的切口，其从每个单元引线框架的周边切断引线，并且在引线所在的周边的区域中至少部分地延伸到模制化合物中，使得模制化合物保持 切割之间完好无损。 在形成切口之后处理引线框条，然后将单元引线框架分离成单个封装。

公开(公告)号：US09754834B2

公开(公告)日：2017-09-05

申请号：US15254454

申请日：2016-09-01

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/46 ,  H01L21/78 ,  H01L21/301 ,  H01L21/44 ,  H01L21/50 ,  H01L21/48 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  B23K101/40 ,  B23K103/16 ,  B23K103/00

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to each of the die paddles, the unit lead frames are covered with a molding compound after the semiconductor dies are attached to the die paddles, and a laser beam is directed at regions of the periphery of each unit lead frame where the leads are located thereby forming spaced apart cuts in the periphery of each unit lead frame. The spaced apart cuts sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in the regions of the periphery where the leads are located so that the molding compound remains intact between the spaced apart cuts.

公开(公告)号：US20160372374A1

公开(公告)日：2016-12-22

申请号：US15254454

申请日：2016-09-01

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/78 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to each of the die paddles, the unit lead frames are covered with a molding compound after the semiconductor dies are attached to the die paddles, and a laser beam is directed at regions of the periphery of each unit lead frame where the leads are located thereby forming spaced apart cuts in the periphery of each unit lead frame. The spaced apart cuts sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in the regions of the periphery where the leads are located so that the molding compound remains intact between the spaced apart cuts.

Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 将半导体管芯连接到每个管芯焊盘上，在将半导体管芯安装到管芯焊盘上之后，单元引线框架被模制化合物覆盖，并且激光束被引导到每个单元引线框架的周边区域 引线被定位，从而在每个单元引线框架的外围形成间隔开的切口。 间隔开的切口从每个单元引线框架的周边切断引线，并且在引线位于周边的区域中至少部分地延伸到模制化合物中，使得模制化合物在间隔开的切口之间保持完整。

公开(公告)号：US09437458B2

公开(公告)日：2016-09-06

申请号：US14077742

申请日：2013-11-12

Applicant: Infineon Technologies AG

Inventor： Nee Wan Khoo ,  Vigneswaran Letcheemana

IPC: H01L21/304 ,  H01L21/00 ,  H01L21/02 ,  H01L21/78 ,  H01L21/301 ,  H01L21/48 ,  B23K26/36 ,  B23K26/40 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L21/78 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/166 ,  B23K2103/50 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L22/14 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles and covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles. Spaced apart cuts are formed in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts. The lead frame strip is processed after the cuts are formed, and the unit lead frames are later separated into individual packages.

Abstract translation: 引线框架条包括多个连接的单元引线框架，每个单元引线框架具有管芯焊盘和连接到单元引线框架的外围的多个引线。 通过在将半导体管芯附接到管芯焊盘上之后，通过将半导体管芯附接到每个管芯焊盘并且用模制化合物覆盖单元引线框架来处理引线框架条。 在每个单元引线框架的周边形成间隔开的切口，其从每个单元引线框架的周边切断引线，并且在引线所在的周边的区域中至少部分地延伸到模制化合物中，使得模制化合物保持 切割之间完好无损。 在形成切口之后处理引线框条，然后将单元引线框架分离成单个封装。