公开(公告)号：US20220199478A1

公开(公告)日：2022-06-23

申请号：US17552914

申请日：2021-12-16

Applicant: Infineon Technologies AG

Inventor： Si Hao Vincent Yeo ,  Chan Lam Cha ,  Ying Dieh Cheong ,  Chau Fatt Chiang ,  Cher Hau Danny Koh ,  Wern Ken Daryl Wee ,  Swee Kah Lee ,  Desmond Jenn Yong Loo ,  Fortunato Lopez ,  Norliza Morban ,  Khay Chwan Andrew Saw ,  Sock Chien Tey ,  Mei Yong Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/495

Abstract: A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.

公开(公告)号：US12300559B2

公开(公告)日：2025-05-13

申请号：US17552914

申请日：2021-12-16

Applicant: Infineon Technologies AG

Inventor： Si Hao Vincent Yeo ,  Chan Lam Cha ,  Ying Dieh Cheong ,  Chau Fatt Chiang ,  Cher Hau Danny Koh ,  Wern Ken Daryl Wee ,  Swee Kat Lee ,  Desmond Jenn Yong Loo ,  Fortunato Lopez ,  Norliza Morban ,  Khay Chwan Andrew Saw ,  Sock Chien Tey ,  Mei Yong Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/495

Abstract: A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.