公开(公告)号：US12300559B2

公开(公告)日：2025-05-13

申请号：US17552914

申请日：2021-12-16

Applicant: Infineon Technologies AG

Inventor： Si Hao Vincent Yeo ,  Chan Lam Cha ,  Ying Dieh Cheong ,  Chau Fatt Chiang ,  Cher Hau Danny Koh ,  Wern Ken Daryl Wee ,  Swee Kat Lee ,  Desmond Jenn Yong Loo ,  Fortunato Lopez ,  Norliza Morban ,  Khay Chwan Andrew Saw ,  Sock Chien Tey ,  Mei Yong Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/495

Abstract: A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.

公开(公告)号：US20230170329A1

公开(公告)日：2023-06-01

申请号：US17888669

申请日：2022-08-16

Applicant: Infineon Technologies AG

Inventor： Sock Chien Tey ,  Keck Tim Ang ,  Chan Lam Cha ,  Chau Fatt Chiang ,  Badrul Hisyam Ismail ,  Desmond Jenn Yong Loo ,  Ronizan Mohd Salleh ,  Norliza Morban ,  Si Hao Vincent Yeo ,  Chee Mun Wai ,  Fee Hoon Wendy Wong

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/482 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/4824 ,  H01L24/16 ,  H01L23/5386 ,  H01L24/32 ,  H01L21/568 ,  H01L25/50 ,  H01L2224/16157 ,  H01L2224/32145

Abstract: A method of forming a semiconductor package includes providing a metal baseplate including a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.

公开(公告)号：US20220199478A1

公开(公告)日：2022-06-23

申请号：US17552914

申请日：2021-12-16

Applicant: Infineon Technologies AG

Inventor： Si Hao Vincent Yeo ,  Chan Lam Cha ,  Ying Dieh Cheong ,  Chau Fatt Chiang ,  Cher Hau Danny Koh ,  Wern Ken Daryl Wee ,  Swee Kah Lee ,  Desmond Jenn Yong Loo ,  Fortunato Lopez ,  Norliza Morban ,  Khay Chwan Andrew Saw ,  Sock Chien Tey ,  Mei Yong Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/495

Abstract: A package includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant encapsulating at least part of the dielectric carrier and the electronic component. Corresponding methods of manufacturing the package are also described.