公开(公告)号：US20210057375A1

公开(公告)日：2021-02-25

申请号：US16991123

申请日：2020-08-12

Applicant: Infineon Technologies AG

Inventor： Wee Aun Jason Lim ,  Paul Armand Asentista Calo ,  Ting Soon Chin ,  Chooi Mei Chong ,  Sanjay Kumar Murugan ,  Ying Pok Sam ,  Chee Voon Tan

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A power semiconductor package includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip and having a first surface that is coupled to a power electrode of the power semiconductor chip, an encapsulation body at least partially encapsulating the power semiconductor chip and the electrical connector, and an electrical insulation layer arranged at a second surface of the electrical connector opposite the first surface, wherein parts of the encapsulation body and the electrical insulation layer form a coplanar surface of the power semiconductor package.

公开(公告)号：US11211356B2

公开(公告)日：2021-12-28

申请号：US16991123

申请日：2020-08-12

Applicant: Infineon Technologies AG

Inventor： Wee Aun Jason Lim ,  Paul Armand Asentista Calo ,  Ting Soon Chin ,  Chooi Mei Chong ,  Sanjay Kumar Murugan ,  Ying Pok Sam ,  Chee Voon Tan

IPC: H01L23/495 ,  H01L23/28 ,  H01L21/00 ,  H05K7/18 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

Abstract: A power semiconductor package includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip and having a first surface that is coupled to a power electrode of the power semiconductor chip, an encapsulation body at least partially encapsulating the power semiconductor chip and the electrical connector, and an electrical insulation layer arranged at a second surface of the electrical connector opposite the first surface, wherein parts of the encapsulation body and the electrical insulation layer form a coplanar surface of the power semiconductor package.