公开(公告)号：US20230178701A1

公开(公告)日：2023-06-08

申请号：US18051543

申请日：2022-11-01

Applicant: InnoLux Corporation

Inventor： Chao-Sen YANG ,  Chueh-Yuan NIEN ,  Chao-Chin SUNG ,  Chien-Tzu CHU

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L2224/16227 ,  H01L24/16

Abstract: An electronic device includes a substrate; a first bonding pad and a second bonding pad disposed on the substrate; an electronic assembly on the substrate; a first conductive structure; and a second conductive structure. The electronic assembly includes a third bonding pad and a fourth bonding pad. The third bonding pad is electrically connected to the first bonding pad by the first conductive structure and the fourth bonding pad is electrically connected to the second bonding pad by the second conductive structure. The thickness of the first conductive structure and the thickness of the second conductive structure are greater than or equal to 10 μm and less than or equal to 30 μm.

公开(公告)号：US20230122163A1

公开(公告)日：2023-04-20

申请号：US17932735

申请日：2022-09-16

Applicant: InnoLux Corporation

Inventor： Chao-Sen YANG ,  Chueh-Yuan NIEN ,  Chao-Chin SUNG ,  Chien-Tzu CHU

IPC: H01L33/00 ,  H01L33/62

Abstract: A method for fabricating an electronic device is provided. The method includes the following steps. A substrate is provided. A solder and a flux are formed on the substrate. An electronic component is bonded on the solder. At least a portion of the flux is removed. An electronic device is also provided.

公开(公告)号：US20240006553A1

公开(公告)日：2024-01-04

申请号：US18327262

申请日：2023-06-01

Applicant: InnoLux Corporation

Inventor： Chao-Chin SUNG ,  Chueh-Yuan NIEN ,  Chien-Tzu CHU ,  Chao-Sen YANG

IPC: H01L33/10 ,  H01L33/62

CPC classification number: H01L33/10 ,  H01L33/62

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a light-emitting unit, and a reflective structure. The driving substrate includes a contact. The light-emitting unit is disposed on the driving substrate and electrically connected to the contact. The reflective structure is disposed on the driving substrate. Wherein the reflective structure includes a first insulating layer, a metal layer, and a second insulating layer, and the metal layer is disposed between the first insulating layer and the second insulating layer.

公开(公告)号：US20230123605A1

公开(公告)日：2023-04-20

申请号：US17932728

申请日：2022-09-16

Applicant: InnoLux Corporation

Inventor： Chueh-Yuan NIEN ,  Chao-Chin SUNG ,  Chao-Sen YANG ,  Chien-Tzu CHU ,  Yu-Chien KAO ,  Li-Wei SUNG

IPC: H01L29/786 ,  H01L29/66

Abstract: A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a thin-film transistor layer on the substrate; forming a first passivation layer on the substrate; forming an organic layer on the substrate; patterning the organic layer to expose a first region; forming a second passivation layer on the substrate; patterning the first passivation layer to expose a second region; forming a bonding pad on the substrate, wherein the bonding pad corresponds to an overlapping area of the first region and the second region; and bonding an electronic component to the bonding pad. An electronic device manufactured by the method is also provided.