ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20230178701A1

    公开(公告)日:2023-06-08

    申请号:US18051543

    申请日:2022-11-01

    CPC classification number: H01L33/62 H01L2224/16227 H01L24/16

    Abstract: An electronic device includes a substrate; a first bonding pad and a second bonding pad disposed on the substrate; an electronic assembly on the substrate; a first conductive structure; and a second conductive structure. The electronic assembly includes a third bonding pad and a fourth bonding pad. The third bonding pad is electrically connected to the first bonding pad by the first conductive structure and the fourth bonding pad is electrically connected to the second bonding pad by the second conductive structure. The thickness of the first conductive structure and the thickness of the second conductive structure are greater than or equal to 10 μm and less than or equal to 30 μm.

    ELECTRONIC DEVICE
    2.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240062731A1

    公开(公告)日:2024-02-22

    申请号:US18354082

    申请日:2023-07-18

    Abstract: An electronic device includes a display panel, a backlight source, an ambient light sensor, and a controller. The backlight source is disposed below the display panel and includes light-emitting units. The ambient light sensor detects the brightness of the ambient light. The controller judges the modes of the electronic device according to the detecting results of the ambient light sensor. When the electronic device is in a low-brightness mode, the brightness of a white frame of the display panel is greater than 0 nit and less than or equal to 50 nits, and in a general mode, the brightness of the white frame of the display panel is greater than 50 nits. The backlight source includes a local dimming function. When in the low-brightness mode, the local dimming function is in a first mode. When in the general mode, the local dimming function is in a second mode.

    ELECTRONIC DEVICE
    3.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240006553A1

    公开(公告)日:2024-01-04

    申请号:US18327262

    申请日:2023-06-01

    CPC classification number: H01L33/10 H01L33/62

    Abstract: An electronic device is provided. The electronic device includes a driving substrate, a light-emitting unit, and a reflective structure. The driving substrate includes a contact. The light-emitting unit is disposed on the driving substrate and electrically connected to the contact. The reflective structure is disposed on the driving substrate. Wherein the reflective structure includes a first insulating layer, a metal layer, and a second insulating layer, and the metal layer is disposed between the first insulating layer and the second insulating layer.

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230123605A1

    公开(公告)日:2023-04-20

    申请号:US17932728

    申请日:2022-09-16

    Abstract: A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a thin-film transistor layer on the substrate; forming a first passivation layer on the substrate; forming an organic layer on the substrate; patterning the organic layer to expose a first region; forming a second passivation layer on the substrate; patterning the first passivation layer to expose a second region; forming a bonding pad on the substrate, wherein the bonding pad corresponds to an overlapping area of the first region and the second region; and bonding an electronic component to the bonding pad. An electronic device manufactured by the method is also provided.

    ELECTRONIC DEVICE
    6.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240021763A1

    公开(公告)日:2024-01-18

    申请号:US18333086

    申请日:2023-06-12

    CPC classification number: H01L33/60 H01L25/167 H01L25/0753

    Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units and a reflective structure. The plurality of light-emitting units are electrically connected to the driving substrate. The reflective structure is disposed adjacent to the plurality of light-emitting units. The reflective structure includes a first reflective element. The first reflective element has a first surface, and the first surface is adjacent to at least one of the plurality of light-emitting units. There is a first distance between an edge of the bottom of the first surface and an edge of the driving substrate. The first distance is greater than 0 mm and less than 10 mm.

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