公开(公告)号：US20180323126A1

公开(公告)日：2018-11-08

申请号：US15943736

申请日：2018-04-03

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chien-Chang Lu ,  Cheng-I Wu ,  Li-Wei Sung ,  Cheng-Chi Wang ,  Chin-Lung Ting

IPC: H01L23/31 ,  H01L23/00 ,  H01L27/02

CPC classification number: H01L23/3107 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L27/0266 ,  H01L2224/0231 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/0239 ,  H01L2224/024

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.

公开(公告)号：US10910285B2

公开(公告)日：2021-02-02

申请号：US15943736

申请日：2018-04-03

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chien-Chang Lu ,  Cheng-I Wu ,  Li-Wei Sung ,  Cheng-Chi Wang ,  Chin-Lung Ting

IPC: H01L23/31 ,  H01L23/00 ,  H01L27/02 ,  H01L25/065 ,  H01L27/12

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.