公开(公告)号：US20220130777A1

公开(公告)日：2022-04-28

申请号：US17115755

申请日：2020-12-08

Applicant: InnoLux Corporation

Inventor： Jen-Hai CHI

IPC: H01L23/66 ,  H01L23/485 ,  H01L23/31 ,  H01Q1/38 ,  H01L23/00

Abstract: A high-frequency device includes a second substrate disposed opposite to a first substrate, a first electrode disposed on a side surface of the first substrate adjacent to the second substrate, a second electrode disposed on a side surface of the second substrate adjacent to the first substrate, a sealant disposed between the first substrate and the second substrate, and a dielectric layer sandwiched between the first substrate and the second substrate by the sealant. The dielectric layer includes a gas or vacuum.

公开(公告)号：US20230154900A1

公开(公告)日：2023-05-18

申请号：US18093331

申请日：2023-01-05

Applicant: InnoLux Corporation

Inventor： Jen-Hai CHI ,  Chia-Ping TSENG ,  Chen-Lin YEH ,  Yan-Zheng WU

IPC: H01L25/07 ,  H01L23/498 ,  H01L23/48 ,  H01L23/31 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L25/072 ,  H01L23/49822 ,  H01L23/481 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16227

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

公开(公告)号：US20240429207A1

公开(公告)日：2024-12-26

申请号：US18826227

申请日：2024-09-06

Applicant: InnoLux Corporation

Inventor： Jen-Hai CHI ,  Chia-Ping TSENG ,  Chen-Lin YEH ,  Yan-Zheng WU

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/66

Abstract: An electronic device includes a carrier, a first electronic element, and a first connecting element. The carrier has a first bonding pad, a first conductive layer, a second conductive layer and an insulating layer with a via. The first conductive layer is disposed between the first bonding pad and the insulating layer, and electrically connected to the second conductive layer through the via. The first electronic element is disposed on the carrier and has a substrate. The first connecting element is disposed between the top surface of the first bonding pad and the first electronic element and electrically connected to the first bonding pad and the first electronic element. The substrate has a through hole which is overlapped with the first bonding pad and the first connecting element. A minimum distance between the through hole and the via is greater than zero.

公开(公告)号：US20220122946A1

公开(公告)日：2022-04-21

申请号：US17505594

申请日：2021-10-19

Applicant: InnoLux Corporation

Inventor： Jen-Hai CHI ,  Chia-Ping TSENG ,  Chen-Lin YEH ,  Yan-Zheng WU

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

公开(公告)号：US20220122945A1

公开(公告)日：2022-04-21

申请号：US17106197

申请日：2020-11-30

Applicant: InnoLux Corporation

Inventor： Jen-Hai CHI ,  Chia-Ping TSENG ,  Chen-Lin YEH ,  Yan-Zheng WU

IPC: H01L25/07 ,  H01L23/498 ,  H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/66

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.