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公开(公告)号：US20240162602A1
公开(公告)日：2024-05-16
申请号：US18401885
申请日：2024-01-02
Applicant: InnoLux Corporation
Inventor： Chia-Ping TSENG , Ker-Yih KAO , Chia-Chi HO , Ming-Yen WENG , Hung-I TSENG , Shu-Ling WU , Huei-Ying CHEN
CPC classification number: H01Q1/38 , G02F1/13439 , H01L21/045 , H01L27/1237 , H01Q3/34 , H01Q3/44 , H01Q9/0407 , G02F1/133345
Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.
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公开(公告)号：US20200045816A1
公开(公告)日：2020-02-06
申请号：US16504884
申请日：2019-07-08
Applicant: InnoLux Corporation
Inventor： Po-Yun HSU , Ker-Yih KAO , Chia-Ping TSENG
Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.
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公开(公告)号：US20230006342A1
公开(公告)日：2023-01-05
申请号：US17929907
申请日：2022-09-06
Applicant: InnoLux Corporation
Inventor： Chia-Ping TSENG , Ker-Yih KAO , Chia-Chi HO , Ming-Yen WENG , Hung-I TSENG , Shu-Ling WU , Huei-Ying CHEN
Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.
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公开(公告)号：US20210176861A1
公开(公告)日：2021-06-10
申请号：US17154599
申请日：2021-01-21
Applicant: InnoLux Corporation
Inventor： Po-Yun HSU , Ker-Yih KAO , Chia-Ping TSENG
Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.
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Patent Agency Ranking
公开(公告)号：US20230154900A1
公开(公告)日：2023-05-18
申请号：US18093331
申请日：2023-01-05
Applicant: InnoLux Corporation
Inventor： Jen-Hai CHI , Chia-Ping TSENG , Chen-Lin YEH , Yan-Zheng WU
CPC classification number: H01L25/072 , H01L23/49822 , H01L23/481 , H01L23/3121 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16227
Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 μm. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.
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公开(公告)号：US20200251812A1
公开(公告)日：2020-08-06
申请号：US16732701
申请日：2020-01-02
Applicant: InnoLux Corporation
Inventor： Chia-Ping TSENG , Ker-Yih KAO , Chia-Chi HO , Ming-Yen WENG , Hung-I TSENG , Shu-Ling WU , Huei-Ying CHEN
Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.
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公开(公告)号：US20240429207A1
公开(公告)日：2024-12-26
申请号：US18826227
申请日：2024-09-06
Applicant: InnoLux Corporation
Inventor： Jen-Hai CHI , Chia-Ping TSENG , Chen-Lin YEH , Yan-Zheng WU
Abstract: An electronic device includes a carrier, a first electronic element, and a first connecting element. The carrier has a first bonding pad, a first conductive layer, a second conductive layer and an insulating layer with a via. The first conductive layer is disposed between the first bonding pad and the insulating layer, and electrically connected to the second conductive layer through the via. The first electronic element is disposed on the carrier and has a substrate. The first connecting element is disposed between the top surface of the first bonding pad and the first electronic element and electrically connected to the first bonding pad and the first electronic element. The substrate has a through hole which is overlapped with the first bonding pad and the first connecting element. A minimum distance between the through hole and the via is greater than zero.
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公开(公告)号：US20220122946A1
公开(公告)日：2022-04-21
申请号：US17505594
申请日：2021-10-19
Applicant: InnoLux Corporation
Inventor： Jen-Hai CHI , Chia-Ping TSENG , Chen-Lin YEH , Yan-Zheng WU
IPC: H01L25/07 , H01L23/00 , H01L23/498 , H01L23/538 , H01L23/66
Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.
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公开(公告)号：US20220122945A1
公开(公告)日：2022-04-21
申请号：US17106197
申请日：2020-11-30
Applicant: InnoLux Corporation
Inventor： Jen-Hai CHI , Chia-Ping TSENG , Chen-Lin YEH , Yan-Zheng WU
Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.
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