公开(公告)号：US20240258218A1

公开(公告)日：2024-08-01

申请号：US18402897

申请日：2024-01-03

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Kuan-Hsueh LIN ,  Shih-Kang LIN

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/81385 ,  H01L2224/81405 ,  H01L2224/81455

Abstract: A semiconductor package device is provided. The semiconductor package device includes a circuit substrate having a first terminal end; a chip disposed on the circuit substrate and having a conductive pad; an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure; and a protective layer disposed on the circuit substrate and surrounding the chip, wherein the width of the first terminal end is greater than or equal to the width of the auxiliary structure.