公开(公告)号：US20250046991A1

公开(公告)日：2025-02-06

申请号：US18763072

申请日：2024-07-03

Applicant: InnoLux Corporation

Inventor： Zi-Zhong WANG ,  Kuan-Hsueh LIN ,  Yung-Fu CHANG ,  Lung-Shu HUANG

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/24

Abstract: An electronic device includes a circuit structure, an electronic component electrically connected to the circuit structure, an antenna unit disposed on the circuit structure, and a shielding layer surrounding the electronic component. The circuit structure has a first surface and a second surface opposite to the first surface. The first surface has a first portion, a second portion, and a third portion, wherein the third portion connects the first portion and the second portion. In the normal direction of the electronic device, the third portion is closer to the second surface than the first portion or the second portion, thereby forming a recess. The electronic component is disposed in the recess. The antenna unit is disposed on the first surface of the circuit structure and is electrically connected to the electronic component through the circuit structure.

公开(公告)号：US20240258218A1

公开(公告)日：2024-08-01

申请号：US18402897

申请日：2024-01-03

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Kuan-Hsueh LIN ,  Shih-Kang LIN

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/81385 ,  H01L2224/81405 ,  H01L2224/81455

Abstract: A semiconductor package device is provided. The semiconductor package device includes a circuit substrate having a first terminal end; a chip disposed on the circuit substrate and having a conductive pad; an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure; and a protective layer disposed on the circuit substrate and surrounding the chip, wherein the width of the first terminal end is greater than or equal to the width of the auxiliary structure.

公开(公告)号：US20240162185A1

公开(公告)日：2024-05-16

申请号：US18088609

申请日：2022-12-25

Applicant: InnoLux Corporation

Inventor： Chin-Ming HUANG ,  Cheng-Chi WANG ,  Kuan-Hsueh LIN

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/13105 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/81385

Abstract: An electronic device including a circuit structure, a bonding element and an electronic unit is disclosed. The circuit structure includes a conductive pad, and the conductive pad has an accommodating recess. At least a portion of the bonding element is disposed in the accommodating recess. The electronic unit is electrically connected to the conductive pad through the bonding element. The accommodating recess has a bottom surface and an opening opposite to the bottom surface, and a width of the bottom surface is greater than a width of the opening.