公开(公告)号：US20240006400A1

公开(公告)日：2024-01-04

申请号：US17856965

申请日：2022-07-02

申请人： Intel Corporation

发明人： Kyle J. Arrington ,  Karumbu Nathan Meyyappan ,  Srikant Nekkanty

IPC分类号： H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L25/18 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13105 ,  H01L2224/13139 ,  H01L2224/13169 ,  H01L2224/13144 ,  H01L2224/13166 ,  H01L2224/13184 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81418 ,  H01L2924/01008 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L24/29

摘要： In one embodiment, an integrated circuit assembly includes a substrate comprising electrical connectors on a top side of the substrate and an integrated circuit die coupled to the top side of the substrate. The integrated circuit die includes metal pillars extending from a bottom side of the die facing the top side of the substrate, and the metal pillars of the integrated circuit die are electrically connected to the electrical connectors of the substrate via a liquid metal (e.g., a Gallium-based alloy).

公开(公告)号：US07750484B2

公开(公告)日：2010-07-06

申请号：US12146003

申请日：2008-06-25

申请人： Shigeru Mizuno ,  Takashi Kurihara

发明人： Shigeru Mizuno ,  Takashi Kurihara

IPC分类号： H01L23/498

CPC分类号： H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81405 ,  H01L2224/81825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of manufacturing a semiconductor device in which a semiconductor element 10 is mounted on a substrate 20 through a flip-chip connection, includes the steps of cladding gallium as a bonding material 30 to a connecting pad 22 formed on a surface of the substrate 20, diffusing copper from the connecting pad 22 formed of the copper into the bonding material 30 through heating under vacuum, thereby bringing a state of a solid solution of the gallium and the copper, and aligning a connecting bump 12 formed on the semiconductor element 10 with the connecting pad 22 and bonding the connecting bump 12 to the connecting pad 22 through the bonding material 30 in a state of a solid solution under heating.

摘要翻译： 通过倒装芯片连接将半导体元件10安装在基板20上的半导体器件的制造方法包括以下步骤：将形成在基板20的表面上的连接焊盘22作为接合材料30包覆镓 通过在真空下加热将铜从铜连接焊盘22扩散到接合材料30中，从而使镓和铜的固溶状态，并使形成在半导体元件10上的连接凸块12与形成在半导体元件10上的连接凸块12与 连接焊盘22，并且在加热下处于固溶状态下，通过接合材料30将连接凸块12接合到连接焊盘22。

公开(公告)号：US09439298B2

公开(公告)日：2016-09-06

申请号：US14181412

申请日：2014-02-14

申请人： LOTES CO., LTD

发明人： Ted Ju

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H01R13/03 ,  H01R13/24 ,  H01L23/498 ,  H01L23/00

CPC分类号： H05K3/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16235 ,  H01L2224/81101 ,  H01L2224/81405 ,  H01L2224/81411 ,  H01L2224/81494 ,  H01L2224/81505 ,  H01L2224/81594 ,  H01L2224/81691 ,  H01L2224/81711 ,  H01L2224/819 ,  H01R13/035 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10962 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0715

摘要： An electrical connector for electrically connecting a first electronic element to a second electronic element includes an insulating body and multiple conductors. The insulating body has multiple accommodating holes. Each conductor is accommodated in a corresponding accommodating hole. Each conductor has an elastic insulator and low melting point liquid metal wrapping a surface of the elastic insulator, such that a continuous conducting path is formed by the liquid metal between the first electronic element and the second electronic element.

摘要翻译： 用于将第一电子元件电连接到第二电子元件的电连接器包括绝缘体和多个导体。 绝缘体具有多个容纳孔。 每个导体容纳在相应的容纳孔中。 每个导体具有包裹弹性绝缘体的表面的弹性绝缘体和低熔点液体金属，使得在第一电子元件和第二电子元件之间由液态金属形成连续导电路径。

公开(公告)号：US09397021B2

公开(公告)日：2016-07-19

申请号：US14538352

申请日：2014-11-11

申请人： LOTES CO., LTD

发明人： Ted Ju

IPC分类号： H01L23/32 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/90 ,  H01L24/91 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13205 ,  H01L2224/13209 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/1339 ,  H01L2224/13409 ,  H01L2224/13411 ,  H01L2224/13418 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81505 ,  H01L2224/81509 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/8169 ,  H01L2224/81709 ,  H01L2224/81711 ,  H01L2224/81718 ,  H01L2224/81901 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01031 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2224/72 ,  H01L2224/16

摘要： An electrical connector for electrically connecting a chip module to a circuit board, includes an insulating body, multiple conducting bodies, and multiple pieces of low melting point metal. The insulating body has multiple accommodating spaces. Each accommodating space runs through upper and lower surfaces of the insulating body. The multiple conducting bodies are respectively received in the accommodating spaces. Two ends of each conducting body are exposed on the upper and lower surfaces of the insulating body. The low melting point metal is gallium or gallium alloy. Each piece of the low melting point metal is correspondingly arranged at at least one end of one of the conducting bodies. The low melting point metal protrudes from the insulating body, and is electrically connected to the chip module.

摘要翻译： 用于将芯片模块电连接到电路板的电连接器包括绝缘体，多个导电体和多片低熔点金属。 绝缘体具有多个容纳空间。 每个容纳空间穿过绝缘体的上表面和下表面。 多个导电体分别容纳在容纳空间中。 每个导电体的两端暴露在绝缘体的上表面和下表面上。 低熔点金属是镓或镓合金。 每片低熔点金属相应地布置在一个导电体的至少一端。 低熔点金属从绝缘体突出并与芯片模块电连接。

公开(公告)号：US20150146383A1

公开(公告)日：2015-05-28

申请号：US14538352

申请日：2014-11-11

申请人： Lotes Co., Ltd

发明人： Ted Ju

IPC分类号： H01L23/00

CPC分类号： H01L23/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/90 ,  H01L24/91 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13205 ,  H01L2224/13209 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/1339 ,  H01L2224/13409 ,  H01L2224/13411 ,  H01L2224/13418 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81505 ,  H01L2224/81509 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/8169 ,  H01L2224/81709 ,  H01L2224/81711 ,  H01L2224/81718 ,  H01L2224/81901 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01031 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2224/72 ,  H01L2224/16

摘要： An electrical connector for electrically connecting a chip module to a circuit board, includes an insulating body, multiple conducting bodies, and multiple pieces of low melting point metal. The insulating body has multiple accommodating spaces. Each accommodating space runs through upper and lower surfaces of the insulating body. The multiple conducting bodies are respectively received in the accommodating spaces. Two ends of each conducting body are exposed on the upper and lower surfaces of the insulating body. The low melting point metal is gallium or gallium alloy. Each piece of the low melting point metal is correspondingly arranged at at least one end of one of the conducting bodies. The low melting point metal protrudes from the insulating body, and is electrically connected to the chip module.

摘要翻译： 用于将芯片模块电连接到电路板的电连接器包括绝缘体，多个导电体和多片低熔点金属。 绝缘体具有多个容纳空间。 每个容纳空间穿过绝缘体的上表面和下表面。 多个导电体分别容纳在容纳空间中。 每个导电体的两端暴露在绝缘体的上表面和下表面上。 低熔点金属是镓或镓合金。 每片低熔点金属相应地布置在一个导电体的至少一端。 低熔点金属从绝缘体突出并与芯片模块电连接。

公开(公告)号：US5829125A

公开(公告)日：1998-11-03

申请号：US698163

申请日：1996-08-07

申请人： Masayuki Fujimoto ,  Matsuo Nakazawa ,  Hiroshi Takahashi ,  Kazutaka Suzuki ,  Koichiro Isuzuku

发明人： Masayuki Fujimoto ,  Matsuo Nakazawa ,  Hiroshi Takahashi ,  Kazutaka Suzuki ,  Koichiro Isuzuku

IPC分类号： B23K1/005 ,  H01L21/60 ,  H01L23/13 ,  H01L23/485 ,  H01L25/18 ,  H05K3/34

CPC分类号： H01L23/13 ,  B23K1/0056 ,  H01L24/05 ,  H01L24/81 ,  H01L25/18 ,  H05K3/3494 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05566 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/05609 ,  H01L2224/05613 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08057 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75262 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81385 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81413 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/8184 ,  H01L2224/81868 ,  H01L2224/81874 ,  H01L2224/83224 ,  H01L24/13 ,  H01L24/75 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/351 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K3/3431 ,  Y10T29/49144

摘要： The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit module manufacturing method in which an external electrode of a component and a conductor of a substrate are connected with each other according to the wireless bonding technique, the substrate has a laser beam transmissible property, and after the component is placed on an assembly surface of the substrate, a laser beam is applied from a surface of the substrate opposite to the assembly surface thereof to a connecting spot. The laser beam passing through the substrate heats the connecting spot so that the connection between the external electrode of the component and the conductor of the substrate is made by phase transition or diffusion.

摘要翻译： 本发明涉及通过使用无线接合技术制造电路模块的方法。 在本发明中，为了实现不经受热和机械应力的部件组装，在根据无线接合技术将部件的外部电极和基板的导体彼此连接的电路模块制造方法中， 基板具有激光束透射性质，并且在将部件放置在基板的组装表面上之后，将激光束从与其组装表面相对的基板的表面施加到连接点。 通过基板的激光束加热连接点，使得部件的外部电极与基板的导体之间的连接通过相变或扩散来制造。

公开(公告)号：US20240258218A1

公开(公告)日：2024-08-01

申请号：US18402897

申请日：2024-01-03

申请人： InnoLux Corporation

发明人： Cheng-Chi WANG ,  Kuan-Hsueh LIN ,  Shih-Kang LIN

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/81385 ,  H01L2224/81405 ,  H01L2224/81455

摘要： A semiconductor package device is provided. The semiconductor package device includes a circuit substrate having a first terminal end; a chip disposed on the circuit substrate and having a conductive pad; an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure; and a protective layer disposed on the circuit substrate and surrounding the chip, wherein the width of the first terminal end is greater than or equal to the width of the auxiliary structure.

公开(公告)号：US20150163897A1

公开(公告)日：2015-06-11

申请号：US14181412

申请日：2014-02-14

申请人： LOTES CO., LTD

发明人： Ted Ju

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC分类号： H05K3/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16235 ,  H01L2224/81101 ,  H01L2224/81405 ,  H01L2224/81411 ,  H01L2224/81494 ,  H01L2224/81505 ,  H01L2224/81594 ,  H01L2224/81691 ,  H01L2224/81711 ,  H01L2224/819 ,  H01R13/035 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10962 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0715

摘要： An electrical connector for electrically connecting a first electronic element to a second electronic element includes an insulating body and multiple conductors. The insulating body has multiple accommodating holes. Each conductor is accommodated in a corresponding accommodating hole. Each conductor has an elastic insulator and low melting point liquid metal wrapping a surface of the elastic insulator, such that a continuous conducting path is formed by the liquid metal between the first electronic element and the second electronic element.

摘要翻译： 用于将第一电子元件电连接到第二电子元件的电连接器包括绝缘体和多个导体。 绝缘体具有多个容纳孔。 每个导体容纳在相应的容纳孔中。 每个导体具有包裹弹性绝缘体的表面的弹性绝缘体和低熔点液体金属，使得在第一电子元件和第二电子元件之间由液态金属形成连续导电路径。

公开(公告)号：US20090001571A1

公开(公告)日：2009-01-01

申请号：US12146003

申请日：2008-06-25

申请人： Shigeru Mizuno ,  Takashi Kurihara

发明人： Shigeru Mizuno ,  Takashi Kurihara

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81405 ,  H01L2224/81825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of manufacturing a semiconductor device in which a semiconductor element 10 is mounted on a substrate 20 through a flip-chip connection, includes the steps of cladding gallium as a bonding material 30 to a connecting pad 22 formed on a surface of the substrate 20, diffusing copper from the connecting pad 22 formed of the copper into the bonding material 30 through heating under vacuum, thereby bringing a state of a solid solution of the gallium and the copper, and aligning a connecting bump 12 formed on the semiconductor element 10 with the connecting pad 22 and bonding the connecting bump 12 to the connecting pad 22 through the bonding material 30 in a state of a solid solution under heating.

摘要翻译： 通过倒装芯片连接将半导体元件10安装在基板20上的半导体器件的制造方法包括以下步骤：将形成在基板20的表面上的连接焊盘22作为接合材料30包覆镓 通过在真空下加热将铜从铜连接焊盘22扩散到接合材料30中，从而使镓和铜的固溶状态，并使形成在半导体元件10上的连接凸块12与形成在半导体元件10上的连接凸块12与 连接焊盘22，并且在加热下处于固溶状态下，通过接合材料30将连接凸块12接合到连接焊盘22。