公开(公告)号：US20230395452A1

公开(公告)日：2023-12-07

申请号：US17811909

申请日：2022-07-12

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Chin-Ming HUANG ,  Yi-Reng CHEN

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3192 ,  H01L24/20 ,  H01L24/19 ,  H01L24/96 ,  H01L21/561 ,  H01L21/566 ,  H01L2924/3512 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/95001 ,  H01L2924/3511 ,  H01L23/3171

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an electronic unit, a first insulating layer, a second insulating layer and a connecting element. The electronic unit includes a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface to the second surface. The first insulating layer is disposed on the second surface. The second insulating layer is disposed on the first insulating layer. The second insulating layer includes a third surface, a fourth surface opposite to the third surface, and a second side surface connecting the third surface to the fourth surface. The connecting element is disposed on the second insulating layer and is electrically connected to the electronic unit. The third surface of the second insulating layer is in contact with the second surface of the electronic unit.