公开(公告)号：US11782308B2

公开(公告)日：2023-10-10

申请号：US17697080

申请日：2022-03-17

Applicant: InnoLux Corporation

Inventor： Shan-Shan Hsu ,  Ming-Tsang Wu ,  Chia-Chieh Fan

IPC: G02F1/13357 ,  H05K1/18 ,  G02F1/1335

CPC classification number: G02F1/133603 ,  G02F1/133528 ,  H05K1/189 ,  G02F2202/28 ,  H05K2201/10136

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

公开(公告)号：US11307454B2

公开(公告)日：2022-04-19

申请号：US17010186

申请日：2020-09-02

Applicant: InnoLux Corporation

Inventor： Shan-Shan Hsu ,  Ming-Tsang Wu ,  Chia-Chieh Fan

IPC: G02F1/13357 ,  H05K1/18 ,  G02F1/1335

Abstract: An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

公开(公告)号：US20230025999A1

公开(公告)日：2023-01-26

申请号：US17849701

申请日：2022-06-27

Applicant: Innolux Corporation

Inventor： Hao-Jung Huang ,  Chi-Liang Chang ,  I-Ho Shen ,  Ker-Yih Kao ,  Yun-Sheng Chen ,  Chiao-Chu Tsui ,  Chih-Han Ma ,  Shan-Shan Hsu ,  Chia-Chieh Fan

IPC: H01L23/31 ,  H01L23/60 ,  H01L27/15 ,  H01L25/075 ,  H01L51/52 ,  H01L25/04 ,  H01L27/32

Abstract: An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.