公开(公告)号：US20250006577A1

公开(公告)日：2025-01-02

申请号：US18675129

申请日：2024-05-27

Applicant: Innolux Corporation

Inventor： Mei-Yen Chen ,  Ju-Li Wang ,  Yen-Fu Liu

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/40 ,  H01L23/498

Abstract: An electronic device including an electronic element, an encapsulation layer, a circuit structure, a bonding element, and a bolt is provided. The encapsulation layer surrounds the electronic element. The circuit structure is electrically connected to the electronic element. The bonding element is electrically connected to the electronic element via the circuit structure. The bolt is disposed between the circuit structure and the encapsulation layer. A manufacturing method of an electronic device is also provided.

公开(公告)号：US20240079348A1

公开(公告)日：2024-03-07

申请号：US18231245

申请日：2023-08-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih Kao ,  Cheng-Chi Wang ,  Yen-Fu Liu ,  Ju-Li Wang ,  Jui-Jen Yueh

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L29/786

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/08 ,  H01L29/78603 ,  H01L2224/08225

Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.