公开(公告)号：US20030020509A1

公开(公告)日：2003-01-30

申请号：US09954355

申请日：2001-09-12

Applicant: Integrated Device Technology, Inc.

Inventor： Kong Lam Song ,  Peng Cheong Choe

IPC: G01R031/26

CPC classification number: G01R1/07314 ,  H01L21/67126

Abstract: An integral system for testing integrated circuits (ICs) mounted on an assembly strip after lead formation and before separation from the assembly strip. The ICs are arranged in rows and columns on each assembly strip such that the sides of each IC are connected to leads extending from the assembly strip, and the ends of each IC are held by the assembly strip. The strips are loaded into the system and passed to a first station at which leads are cut and formed while the ends of each IC remain connected to the assembly strip. The assembly strips are then passed to a test apparatus that transmits test signals to the ICs through the formed leads. The IC devices are then separated from the assembly strip using a singulation apparatus, and the separated ICs are stored in tubes for delivery. Visual inspection is also performed at various stages.

Abstract translation: 一种集成电路（IC）的集成系统，用于在引线形成之后和在与组件条分离之前安装在组装条上。 IC在每个组装条上以行和列布置，使得每个IC的侧面连接到从组装条延伸的引线，并且每个IC的端部由组装带保持。 将条带装载到系统中并传送到第一工位，在该第一工位处切割和形成引线，同时每个IC的端部保持连接到组装条上。 组装条然后传递到通过形成的引线将测试信号传输到IC的测试装置。 然后使用分离装置将IC器件与组装条分开，并将分离的IC存储在用于输送的管中。 目视检查也在不同阶段进行。

公开(公告)号：US20030022405A1

公开(公告)日：2003-01-30

申请号：US09953698

申请日：2001-09-12

Applicant: Integrated Device Technology, Inc.

Inventor： Kong Lam Song ,  Peng Cheong Choe

IPC: H01L021/66 ,  G01R031/26

CPC classification number: G01R31/2831 ,  G01R1/0433 ,  H01L23/495 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for testing integrated circuits (ICs) mounted on an assembly strip after lead formation and before separation from the assembly strip. The ICs are arranged in rows and columns on each assembly strip such that the sides of each IC are connected to leads extending from the assembly strip, and the ends of each IC are held by the assembly strip. The strips are loaded into the system and passed to a first station at which leads are cut and formed while the ends of each IC remain connected to the assembly strip. The assembly strips are then passed to a test apparatus that transmits test signals to the ICs through the formed leads. The IC devices are then separated from the assembly strip using a singulation apparatus, and the separated ICs are stored in tubes for delivery. Visual inspection is also performed at various stages.

Abstract translation: 一种用于在引线形成之后和在与组件条分离之前测试安装在组装带上的集成电路（IC）的方法。 IC在每个组装条上以行和列布置，使得每个IC的侧面连接到从组装条延伸的引线，并且每个IC的端部由组装带保持。 将条带装载到系统中并传送到第一工位，在该第一工位处切割和形成引线，同时每个IC的端部保持连接到组装条上。 组装条然后传递到通过形成的引线将测试信号传输到IC的测试装置。 然后使用分离装置将IC器件与组装条分开，并将分离的IC存储在用于输送的管中。 目视检查也在不同阶段进行。