公开(公告)号：US10079266B2

公开(公告)日：2018-09-18

申请号：US15122129

申请日：2014-03-28

Applicant: Intel Corporation

Inventor： Christopher J. Wiegand ,  Md Tofizur Rahman ,  Oleg Golonzka ,  Anant H. Jahagirdar ,  Mengcheng Lu

IPC: H01L27/22 ,  H01L43/12 ,  G11C11/16 ,  H01L43/02 ,  H01L43/08 ,  H01L43/10

CPC classification number: H01L27/222 ,  G11C11/161 ,  H01L43/02 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12

Abstract: Embodiments of the present disclosure describe techniques and configurations associated with modulation of magnetic properties through implantation. In one embodiment, a method includes providing a substrate having an integrated circuit (IC) structure disposed on the substrate, the IC structure including a magnetizable material, implanting at least a portion of the magnetizable material with a dopant and magnetizing the magnetizable material, wherein said magnetizing is inhibited in the implanted portion of the magnetizable material. Other embodiments may be described and/or claimed.