-
公开(公告)号:US20230089093A1
公开(公告)日:2023-03-23
申请号:US17482804
申请日:2021-09-23
Applicant: Intel Corporation
Inventor: Srinivas V. PIETAMBARAM , Tarek A. IBRAHIM , Krishna BHARATH , Bharat PENMECHA , Anderw COLLINS , Kaladhar RADHAKRISHNAN , Sriram SRINIVASAN
Abstract: Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a plug is formed through the core, where the plug comprises a magnetic material. In an embodiment, an inductor is around the plug. In an embodiment, first layers are over the core, wherein where the first layers comprise a dielectric material; and second layers are under the core, where the second layers comprise the dielectric material.