公开(公告)号：US20230320010A1

公开(公告)日：2023-10-05

申请号：US17711018

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Jyotiba SURYAWANSHI ,  John MATHEW ,  Anudeep GALI ,  Jain Raj VETTUVAZHY PUTHENPURAYIL ,  Ali KALANTARIAN

IPC: H05K5/02 ,  H05K5/03 ,  H05K7/20

CPC classification number: H05K5/0269 ,  H05K5/03 ,  H05K5/0213 ,  H05K7/20172 ,  H05K7/20154

Abstract: An apparatus is described. The apparatus includes a multi-slot add-in card having a second air mover stacked with a first air mover. The add-in card has a heat sink. The heat sink has fins. The fins extend into a first path of a first air flow and a second path of a second air flow. The first air mover is to generate the first air flow and the second air mover is to generate the second air flow.