公开(公告)号：US20230317687A1

公开(公告)日：2023-10-05

申请号：US17710662

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Bhupendra KUMAR ,  Khaled AHMED ,  Andrew William KEATES ,  Jay GUPTA

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L2933/0066 ,  H01L33/62

Abstract: Embodiments disclosed herein include a display. In an embodiment, the display comprises a backplane, and circuitry on the backplane. In an embodiment, a pad with a first width is over the backplane and electrically coupled to the circuitry. In an embodiment, the pad comprises a conductive material. In an embodiment, the display further comprises a light emitting diode (LED) coupled to the pad, where the LED has a second width that is smaller than the first width.