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公开(公告)号:US20230317687A1
公开(公告)日:2023-10-05
申请号:US17710662
申请日:2022-03-31
Applicant: Intel Corporation
Inventor: Bhupendra KUMAR , Khaled AHMED , Andrew William KEATES , Jay GUPTA
IPC: H01L25/075 , H01L33/62
CPC classification number: H01L25/0753 , H01L2933/0066 , H01L33/62
Abstract: Embodiments disclosed herein include a display. In an embodiment, the display comprises a backplane, and circuitry on the backplane. In an embodiment, a pad with a first width is over the backplane and electrically coupled to the circuitry. In an embodiment, the pad comprises a conductive material. In an embodiment, the display further comprises a light emitting diode (LED) coupled to the pad, where the LED has a second width that is smaller than the first width.
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2.
公开(公告)号:US20230069054A1
公开(公告)日:2023-03-02
申请号:US17410257
申请日:2021-08-24
Applicant: Intel Corporation
Inventor: Souvik GHOSH , Han Wui THEN , Pratik KOIRALA , Tushar TALUKDAR , Paul NORDEEN , Nityan NAIR , Marko RADOSAVLJEVIC , Ibrahim BAN , Kimin JUN , Jay GUPTA , Paul B. FISCHER , Nicole K. THOMAS , Thomas HOFF , Samuel James BADER
IPC: H01L29/778 , H01L29/205 , H01L29/66
Abstract: Gallium nitride (GaN) integrated circuit technology with multi-layer epitaxy and layer transfer is described. In an example, an integrated circuit structure includes a first channel structure including a plurality of alternating first channel layers and second channel layers, the first channel layers including gallium and nitrogen, and the second layers including gallium, aluminum and nitrogen. A second channel structure is bonded to the first channel structure. The second channel structure includes a plurality of alternating third channel layers and fourth channel layers, the third channel layers including gallium and nitrogen, and the fourth layers including gallium, aluminum and nitrogen.
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