公开(公告)号：US20250112357A1

公开(公告)日：2025-04-03

申请号：US18817279

申请日：2024-08-28

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tae Young YANG ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Renzhi LIU ,  Kenneth FOUST ,  Bryce HORINE

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01Q1/48 ,  H01Q5/40 ,  H01Q9/04

Abstract: The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.