公开(公告)号：US20230180421A1

公开(公告)日：2023-06-08

申请号：US17540936

申请日：2021-12-02

Applicant: Intel Corporation

Inventor： Carl D. WILLIAMS ,  Steven C. MILLER

IPC: H05K7/14

CPC classification number: H05K7/1492 ,  H05K7/1491

Abstract: An apparatus is described. The apparatus includes a rack shelf back interface. The rack shelf back interface has first and second flanges to mount to a rack’s rear facing rack mounts. The rack shelf back interface has a power connector610 on an inside of a back face of the rack shelf interface, the power connector to mate with a corresponding power connector on an electronic system that is to be installed in the rack shelf. The rack shelf back interface has an alignment feature on the inside of the back face of the rack shelf interface to ensure that the power connector properly mates with the corresponding power connector.

公开(公告)号：US20220173015A1

公开(公告)日：2022-06-02

申请号：US17676105

申请日：2022-02-18

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Jack D. MUMBO ,  Carl D. WILLIAMS ,  Steven C. MILLER

IPC: H01L23/473 ,  H01L23/40 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate. The cold plate includes an input port to receive cooled fluid. The cold plate includes an ingress manifold to feed the cooled fluid to different regions, where, each of the different regions are to be located above its own respective semiconductor chip package. The cold plate includes an egress manifold to collect warmed fluid from the different regions. The cold plate includes an output port to emit the warmed fluid from the cold plate.