公开(公告)号：US20220173015A1

公开(公告)日：2022-06-02

申请号：US17676105

申请日：2022-02-18

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Jack D. MUMBO ,  Carl D. WILLIAMS ,  Steven C. MILLER

IPC: H01L23/473 ,  H01L23/40 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate. The cold plate includes an input port to receive cooled fluid. The cold plate includes an ingress manifold to feed the cooled fluid to different regions, where, each of the different regions are to be located above its own respective semiconductor chip package. The cold plate includes an egress manifold to collect warmed fluid from the different regions. The cold plate includes an output port to emit the warmed fluid from the cold plate.