公开(公告)号：US20250133698A1

公开(公告)日：2025-04-24

申请号：US18989639

申请日：2024-12-20

Applicant: Intel Corporation

Inventor： Chi Chou Cheng ,  Jeff Ku ,  Chung Jen Ho ,  Chihtsung Hu ,  Tsung-Kai Lin

IPC: H05K7/20 ,  G06F1/20

Abstract: An electronic device is provided that implements thermally conductive plastic supports that may replace the typical use of “feet” used in conventional electronic devices. The thermally conductive supports may extend through the bottom chassis cover (e.g. the “D cover”) of the electronic device, and be mechanically and thermally coupled to a heat pipe that is in turn coupled to a heat source for which thermal regulation is utilized. The thermally conductive plastic supports may provide a heat path from the heat source to the bottom chassis cover and, when the electronic device is disposed on a surface, an additional heat path may be provided from the heat source to this surface.