公开(公告)号：US20240431066A1

公开(公告)日：2024-12-26

申请号：US18340577

申请日：2023-06-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Chi Chou Cheng ,  Jeffrey Ho ,  Chih-Tsung Hu ,  Srinivasarao Konakalla ,  Tsung-Kai Lin ,  Arnab Sen ,  Chiu-Chun Wang ,  Jiacheng Wu

IPC: H05K7/20 ,  G06F1/20

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.