公开(公告)号：US20250133698A1

公开(公告)日：2025-04-24

申请号：US18989639

申请日：2024-12-20

Applicant: Intel Corporation

Inventor： Chi Chou Cheng ,  Jeff Ku ,  Chung Jen Ho ,  Chihtsung Hu ,  Tsung-Kai Lin

IPC: H05K7/20 ,  G06F1/20

Abstract: An electronic device is provided that implements thermally conductive plastic supports that may replace the typical use of “feet” used in conventional electronic devices. The thermally conductive supports may extend through the bottom chassis cover (e.g. the “D cover”) of the electronic device, and be mechanically and thermally coupled to a heat pipe that is in turn coupled to a heat source for which thermal regulation is utilized. The thermally conductive plastic supports may provide a heat path from the heat source to the bottom chassis cover and, when the electronic device is disposed on a surface, an additional heat path may be provided from the heat source to this surface.

公开(公告)号：US20250104941A1

公开(公告)日：2025-03-27

申请号：US18474873

申请日：2023-09-26

Applicant: Intel Corporation

Inventor： Yew San Lim ,  Ming-Sheng Tsai ,  Chung Jen Ho ,  Chi Chou Cheng ,  Min Suet Lim ,  Hari Raghavan Jayaraj

IPC: H01H13/807 ,  G06F1/16 ,  H01H13/85 ,  H01H13/86 ,  H01H13/88

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for electronic devices with tactile keyboards. An example electronic device includes a tactile keyboard having a plurality of rows of keys; a printed circuit board; a first row of switches on the printed circuit board, a first row of the plurality of rows of keys to interact with the first row of switches; and a second row of switches on a component adjacent to the printed circuit board, a second row of the plurality of rows of keys to interact with the second row of switches.