公开(公告)号：US20160179149A1

公开(公告)日：2016-06-23

申请号：US14580065

申请日：2014-12-22

Applicant: Intel Corporation

Inventor： JOHN J. VALAVI ,  JAMES R. TRETHEWEY ,  VASUDEVAN SRINIVASAN ,  DOUG HEGGE

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/203 ,  G06F3/0202

Abstract: In one example a electronic device comprises at least one heat generating component, a thermal management module comprising logic, at least partly including hardware logic, to receive a signal from the sensor indicating that the electronic device is coupled to an external device, receive thermal dissipation capability data from the external device, and update a thermal management platform for the electronic device to accommodate the thermal dissipation capability data received from the external device. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括至少一个发热部件，热管理模块，其包括至少部分地包括硬件逻辑的逻辑，以从传感器接收指示电子设备耦合到外部设备的信号，接收散热 并且更新用于电子设备的热管理平台以适应从外部设备接收的散热能力数据。 可以描述其他示例。