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    SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING LATE FUSING OF PROCESSOR FEATURES USING A NON-VOLATILE MEMORY
    3.
    发明申请
    SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING LATE FUSING OF PROCESSOR FEATURES USING A NON-VOLATILE MEMORY 审中-公开

    公开(公告)号：US20180096177A1

    公开(公告)日：2018-04-05

    申请号：US15283364

    申请日：2016-10-01

    Applicant: Intel Corporation

    Inventor： VASUDEVAN SRINIVASAN ,  DANIEL G. BORKOWSKI

    IPC: G06K7/10 ,  G06F12/02 ,  G06F1/26 ,  G06F9/44 ,  H01L23/538 ,  H01L25/18

    CPC classification number: H01L23/5385 ,  G06F1/26 ,  G06F12/0246 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/18

    Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing late fusing of processor features using a non-volatile memory. For instance, there is disclosed in accordance with one embodiment a functional semiconductor package, including: a processor core configurable via a plurality of configuration registers; a non-volatile storage, in which a first portion of the non-volatile storage includes permanently lockable storage that once written cannot be overwritten or modified, and in which a second portion of the non-volatile storage includes the plurality of configuration registers; a first write interface to the non-volatile storage, in which the permanently lockable storage of the non-volatile storage is wirelessly writable externally from the functional semiconductor package via the first write interface; a second write interface to the non-volatile storage through which the plurality of configuration registers are writable; configuration data for the processor core written wirelessly into the permanently lockable storage of the non-volatile storage; and in which the configuration data is distributed into the plurality of configuration registers via the second write interface at every boot of the functional semiconductor package. Other related embodiments are disclosed.

    DYNAMIC COOLING FOR ELECTRONIC DEVICES
    4.
    发明申请
    DYNAMIC COOLING FOR ELECTRONIC DEVICES 审中-公开
    电子设备动态冷却

    公开(公告)号：US20160179149A1

    公开(公告)日：2016-06-23

    申请号：US14580065

    申请日：2014-12-22

    Applicant: Intel Corporation

    Inventor： JOHN J. VALAVI ,  JAMES R. TRETHEWEY ,  VASUDEVAN SRINIVASAN ,  DOUG HEGGE

    IPC: G06F1/20

    CPC classification number: G06F1/206 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/203 ,  G06F3/0202

    Abstract: In one example a electronic device comprises at least one heat generating component, a thermal management module comprising logic, at least partly including hardware logic, to receive a signal from the sensor indicating that the electronic device is coupled to an external device, receive thermal dissipation capability data from the external device, and update a thermal management platform for the electronic device to accommodate the thermal dissipation capability data received from the external device. Other examples may be described.

    Abstract translation: 在一个示例中，电子设备包括至少一个发热部件，热管理模块，其包括至少部分地包括硬件逻辑的逻辑，以从传感器接收指示电子设备耦合到外部设备的信号，接收散热 并且更新用于电子设备的热管理平台以适应从外部设备接收的散热能力数据。 可以描述其他示例。

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