公开(公告)号：US20160187420A1

公开(公告)日：2016-06-30

申请号：US14583218

申请日：2014-12-26

Applicant: Intel Corporation

Inventor： JAMES R. TRETHEWEY ,  PETER S. ADAMSON ,  JOHN J. VALAVI ,  ANANTHA NARAYANAN ,  KANDASUBRAMANIAM K. PALANISAMY ,  IHAB W. SAAD

IPC: G01R31/3177

CPC classification number: G01R31/3177 ,  G01R31/31705 ,  G06F11/2236 ,  G06F11/26 ,  G06F11/36 ,  G06F11/3656

Abstract: Systems and methods may provide for a debug tool including a debug port and a controller including logic to send, via the debug port, a debug mode request to an external port of a target device. Additionally, the target device may include a connector having the external port and a port controller coupled to the external port, wherein the port controller includes logic to detect the debug mode request via the external port, activate a program path between the external port and the port controller in response to the debug mode request, and process one or more commands received via the program path. In one example, the target device further includes a multiplexer coupled to the external port and the port controller, wherein the logic is to send a routing signal to the multiplexer to activate the program path.

Abstract translation: 系统和方法可以提供包括调试端口和控制器的调试工具，该调试端口和控制器包括经由调试端口将调试模式请求发送到目标设备的外部端口的逻辑。 此外，目标设备可以包括具有外部端口的连接器和耦合到外部端口的端口控制器，其中端口控制器包括经由外部端口检测调试模式请求的逻辑，激活外部端口与外部端口之间的程序路径 端口控制器响应于调试模式请求，并处理经由程序路径接收的一个或多个命令。 在一个示例中，目标设备还包括耦合到外部端口和端口控制器的多路复用器，其中逻辑是将路由信号发送到多路复用器以激活程序路径。

公开(公告)号：US20160179149A1

公开(公告)日：2016-06-23

申请号：US14580065

申请日：2014-12-22

Applicant: Intel Corporation

Inventor： JOHN J. VALAVI ,  JAMES R. TRETHEWEY ,  VASUDEVAN SRINIVASAN ,  DOUG HEGGE

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/203 ,  G06F3/0202

Abstract: In one example a electronic device comprises at least one heat generating component, a thermal management module comprising logic, at least partly including hardware logic, to receive a signal from the sensor indicating that the electronic device is coupled to an external device, receive thermal dissipation capability data from the external device, and update a thermal management platform for the electronic device to accommodate the thermal dissipation capability data received from the external device. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括至少一个发热部件，热管理模块，其包括至少部分地包括硬件逻辑的逻辑，以从传感器接收指示电子设备耦合到外部设备的信号，接收散热 并且更新用于电子设备的热管理平台以适应从外部设备接收的散热能力数据。 可以描述其他示例。