公开(公告)号：US20220102887A1

公开(公告)日：2022-03-31

申请号：US17033401

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Feifei CHENG ,  Thomas BOYD ,  Kuang LIU ,  Steven A. KLEIN ,  Daniel NEUMANN ,  Mohanraj PRABHUGOUD

IPC: H01R12/77 ,  H01R12/52 ,  H01R13/629

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20210307153A1

公开(公告)日：2021-09-30

申请号：US16828447

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Feroz MOHAMMAD ,  Ralph V. MIELE ,  Thomas BOYD ,  Steven A. KLEIN ,  Gregorio R. MURTAGIAN ,  Eric W. BUDDRIUS ,  Daniel NEUMANN ,  Rolf LAIDO

IPC: H05K1/02 ,  H01R12/85 ,  H05K1/18

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.