公开(公告)号：US20230317706A1

公开(公告)日：2023-10-05

申请号：US17710753

申请日：2022-03-31

申请人： Intel Corporation

发明人： Kyle ARRINGTON ,  Kuang LIU ,  Bohan SHAN ,  Hongxia FENG ,  Don Douglas JOSEPHSON ,  Stephen MOREIN ,  Kaladhar RADHAKRISHNAN

IPC分类号： H01L25/18 ,  H01L23/373 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L21/48

CPC分类号： H01L25/18 ,  H01L23/3736 ,  H01L25/0652 ,  H01L24/40 ,  H01L23/538 ,  H01L21/4871 ,  H01L24/37 ,  H01L2224/37147 ,  H01L24/83 ,  H01L2224/83385 ,  H01L2224/83447 ,  H01L24/33 ,  H01L2224/3303 ,  H01L24/06 ,  H01L2224/0603 ,  H01L2224/32258 ,  H01L2224/4046 ,  H01L24/32 ,  H01L2224/40499 ,  H01L24/16 ,  H01L2224/16225

摘要： Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.

公开(公告)号：US20220102887A1

公开(公告)日：2022-03-31

申请号：US17033401

申请日：2020-09-25

申请人： Intel Corporation

发明人： Feifei CHENG ,  Thomas BOYD ,  Kuang LIU ,  Steven A. KLEIN ,  Daniel NEUMANN ,  Mohanraj PRABHUGOUD

IPC分类号： H01R12/77 ,  H01R12/52 ,  H01R13/629

摘要： Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20210305731A1

公开(公告)日：2021-09-30

申请号：US16833221

申请日：2020-03-27

申请人： Intel Corporation

发明人： Steven A. KLEIN ,  Kuang LIU ,  Srikant NEKKANTY ,  Feroz MOHAMMAD ,  Donald Tiendung TRAN ,  Srinivasa ARAVAMUDHAN ,  Hemant Mahesh SHAH ,  Alexander W. HUETTIS

IPC分类号： H01R12/70 ,  H01R43/04

摘要： Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.