公开(公告)号：US20220102887A1

公开(公告)日：2022-03-31

申请号：US17033401

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Feifei CHENG ,  Thomas BOYD ,  Kuang LIU ,  Steven A. KLEIN ,  Daniel NEUMANN ,  Mohanraj PRABHUGOUD

IPC: H01R12/77 ,  H01R12/52 ,  H01R13/629

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20210305731A1

公开(公告)日：2021-09-30

申请号：US16833221

申请日：2020-03-27

Applicant: Intel Corporation

Inventor： Steven A. KLEIN ,  Kuang LIU ,  Srikant NEKKANTY ,  Feroz MOHAMMAD ,  Donald Tiendung TRAN ,  Srinivasa ARAVAMUDHAN ,  Hemant Mahesh SHAH ,  Alexander W. HUETTIS

IPC: H01R12/70 ,  H01R43/04

Abstract: Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

公开(公告)号：US20210082798A1

公开(公告)日：2021-03-18

申请号：US16575307

申请日：2019-09-18

Applicant: Intel Corporation

Inventor： Xiao LU ,  Jiongxin LU ,  Christopher COMBS ,  Alexander HUETTIS ,  John HARPER ,  Jieping ZHANG ,  Nachiket R. RARAVIKAR ,  Pramod MALATKAR ,  Steven A. KLEIN ,  Carl DEPPISCH ,  Mohit SOOD

IPC: H01L23/498 ,  B23K3/06 ,  H01L23/538

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

公开(公告)号：US20170269017A1

公开(公告)日：2017-09-21

申请号：US15075083

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Steven A. KLEIN ,  Rajendra C. DIAS ,  David C. MCCOY ,  Lars D. SKOGLUND ,  Vijay SUBRAMANIAN ,  Aleksander ALEKSOV ,  Pramod MALATKAR ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN

IPC: G01N27/20

CPC classification number: G01N27/20 ,  G01L1/04 ,  G01L1/18 ,  G01L1/22 ,  G01N3/08 ,  G01N2033/0078 ,  G01N2033/0095 ,  G01N2203/0042 ,  G01N2203/0044 ,  G01N2203/0062

Abstract: Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.

公开(公告)号：US20240162134A1

公开(公告)日：2024-05-16

申请号：US18418154

申请日：2024-01-19

Applicant: Intel Corporation

Inventor： Xiao LU ,  Jiongxin LU ,  Christopher COMBS ,  Alexander HUETTIS ,  John HARPER ,  Jieping ZHANG ,  Nachiket R. RARAVIKAR ,  Pramod MALATKAR ,  Steven A. KLEIN ,  Carl DEPPISCH ,  Mohit SOOD

IPC: H01L23/498 ,  B23K3/06 ,  H01L23/538

CPC classification number: H01L23/49833 ,  B23K3/0623 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5387

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

公开(公告)号：US20170268972A1

公开(公告)日：2017-09-21

申请号：US15075090

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Vijay Krishnan SUBRAMANIAN ,  Steven A. KLEIN ,  Rajendra C. DIAS ,  Pramod MALATKAR ,  Aleksandar ALEKSOV ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN

IPC: G01N3/08

CPC classification number: G01N3/08 ,  G01N2203/0085

Abstract: Embodiments are generally directed to a lateral expansion apparatus for mechanical testing of stretchable electronics. An embodiment of a system includes a compressible cylinder to apply mechanical forces to a stretchable electronics device by the compression and release of the compressible cylinder; a compression unit to compress to the compressible cylinder, wherein the compression unit is to apply a compression force in a direction along an axis of the compressible cylinder to generate lateral expansion of the compressible cylinder; and a testing logic to control compression and release of the compressible cylinder.

公开(公告)号：US20210307153A1

公开(公告)日：2021-09-30

申请号：US16828447

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Feroz MOHAMMAD ,  Ralph V. MIELE ,  Thomas BOYD ,  Steven A. KLEIN ,  Gregorio R. MURTAGIAN ,  Eric W. BUDDRIUS ,  Daniel NEUMANN ,  Rolf LAIDO

IPC: H05K1/02 ,  H01R12/85 ,  H05K1/18

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

公开(公告)号：US20210183737A1

公开(公告)日：2021-06-17

申请号：US17132391

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Jeffory L. SMALLEY ,  Mohanraj PRABHUGOUD ,  Steven A. KLEIN ,  Mengqi LIU

IPC: H01L23/40 ,  H01L23/495

Abstract: An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.

公开(公告)号：US20170268971A1

公开(公告)日：2017-09-21

申请号：US15075086

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Ravindranth V. MAHAJAN ,  Rajendra C. DIAS ,  Pramod MALATKAR ,  Steven A. KLEIN ,  Vijay SUBRAMANIA ,  Aleksandar ALEKSOV ,  Robert L. SANKMAN

IPC: G01N3/08

CPC classification number: G01N3/08 ,  G01N2203/0085 ,  G01N2203/0282

Abstract: Embodiments are generally directed to membrane test for mechanical testing of wearable devices. A mechanical testing system includes an actuation mechanism including a clamp to hold a membrane including stretchable electronics over an opening in the actuation mechanism, wherein the actuation mechanism is to apply pressure to the membrane through the opening; and a testing logic to control the application and release of pressure on the membrane by the actuation mechanism.