公开(公告)号：US20170269017A1

公开(公告)日：2017-09-21

申请号：US15075083

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： Steven A. KLEIN ,  Rajendra C. DIAS ,  David C. MCCOY ,  Lars D. SKOGLUND ,  Vijay SUBRAMANIAN ,  Aleksander ALEKSOV ,  Pramod MALATKAR ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN

IPC: G01N27/20

CPC classification number: G01N27/20 ,  G01L1/04 ,  G01L1/18 ,  G01L1/22 ,  G01N3/08 ,  G01N2033/0078 ,  G01N2033/0095 ,  G01N2203/0042 ,  G01N2203/0044 ,  G01N2203/0062

Abstract: Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.

公开(公告)号：US20190043747A1

公开(公告)日：2019-02-07

申请号：US16075095

申请日：2016-04-02

Applicant: Intel Corporation

Inventor： Pramod MALATKAR ,  Richard J. HARRIES ,  Robert L. SANKMAN ,  David C. MCCOY

IPC: H01L21/683 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00

Abstract: Techniques and mechanisms for providing flexible packaged circuit structures. In an embodiment, a flexible circuit device includes first and second conductive contacts and an interconnect that is coupled between such conductive contacts. While the flexible circuit device is in a baseline (“flat”) configuration, a first side of the flexible circuit device extends at least in part in a flat plane, and a portion of the interconnect includes a point that, with respect to a distance from the flat plane, is a maximum or a minimum of the interconnect. A mold compound of a flexible package encapsulates the portion of the interconnect. In another embodiment, a range spanned by the interconnect along a line orthogonal to the flat plane is at least two times an average height of the interconnect.